WMSIC Electronic Components

TAI-TECH HCB1005KF-301T10 HCB1005KF

ModelHCB1005KF-301T10
Package0402
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAI-TECH HCB1005KF-301T10
Type
TAI-TECH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAI-TECH
Electronic Component
HCB1005KF-301T10
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.012g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264880409
Current
1A
@Frequency
300Ω@100MHz
Resistor(DCR)
200mΩ
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCB1005KF-301T10 产品概述

HCB1005KF-301T10是台庆电子(TAI-TECH)推出的一款片式射频扼流圈,专为射频电路中的信号隔离、偏置控制及阻抗匹配设计,具备小尺寸、低损耗、高可靠性等特点,广泛适配便携式电子、物联网(IoT)、汽车电子等领域的射频模块。

一、产品基本信息

  • 品牌:台庆电子(TAI-TECH),国内专业射频元器件制造商,产品覆盖片式电感、扼流圈、滤波器等全系列射频元件。
  • 产品型号:HCB1005KF-301T10,型号中“1005”对应公制0402封装(尺寸1.0mm×0.5mm×0.5mm,典型表面贴装尺寸),“301”表示射频阻抗300Ω(30×10¹),“T10”为台庆内部工艺/参数代码。
  • 封装类型:0402片式表面贴装(SMD),无引脚设计,适配自动化贴装生产,节省PCB空间。
  • 通道数:单通道,仅支持一路信号的隔离/匹配功能。

二、核心电性能参数详解

该产品参数针对射频应用场景优化,关键指标如下:

1. 射频阻抗特性

  • 阻抗值:300Ω @ 100MHz,误差±25%(实际范围225Ω~375Ω)。
    此为交流射频阻抗,区别于直流电阻,主要用于射频电路的信号隔离(如阻止射频信号进入直流电源)或阻抗匹配(与电容/电阻组成匹配网络)。100MHz覆盖ISM(工业、科学、医疗)频段中的433MHz、868MHz等相邻频段,适配性较强。

2. 直流电阻(DCR)

  • DCR:200mΩ(0.2Ω),低直流电阻意味着器件在直流偏置电路中损耗极小。
    例如,若通过1A直流电流,器件的直流功耗仅为( I^2R = 1A \times 1A \times 0.2Ω = 0.2W ),远低于常规片式元件的功耗上限,适合低功耗射频电路(如蓝牙低功耗模块)。

3. 额定电流

  • 额定电流:1A(直流额定电流,IDC),表示器件在持续直流负载下可承受的最大电流,超过此值会导致阻抗漂移、性能退化甚至永久损坏。
    若为脉冲电流,需参考台庆官方脉冲规格(通常脉冲宽度<100μs时,脉冲电流可达到3A以上,但需避免长期过载)。

三、设计特点与优势

HCB1005KF-301T10针对射频电路的小型化、低损耗需求设计,核心优势包括:

1. 超小尺寸,适配高密度布局

0402封装(1.0mm×0.5mm)是便携式设备的主流封装,可大幅节省PCB空间,尤其适合智能手机、智能手表、蓝牙耳机等产品的高密度射频模块(如PA偏置电路、天线匹配网络)。

2. 低损耗,提升电路效率

  • 低DCR减少直流偏置损耗,避免器件发热;
  • 100MHz下稳定的300Ω阻抗,减少射频信号反射,降低插入损耗,提升信号传输效率。

3. 高可靠性,满足多场景需求

产品符合RoHS 2.0、无卤等环保标准,经过温度循环(-40℃~85℃)、湿度老化等可靠性测试,可稳定工作在消费级(智能家居)、部分工业级(工业无线传感器)场景。

四、典型应用场景

该产品主要用于射频电路的信号隔离与偏置控制,典型应用包括:

1. 移动设备射频前端

  • 智能手机/平板的功率放大器(PA)偏置电路:作为扼流圈(RFC)隔离射频信号与直流电源,同时为PA提供稳定偏置,避免射频干扰电源纹波。
  • 蓝牙/WiFi模块:在2.4GHz频段的中频处理电路中,用于信号隔离或阻抗匹配,提升通信稳定性。

2. 物联网(IoT)设备

  • 智能传感器(温湿度、运动传感器)的无线模块:适配433MHz/868MHz ISM频段,满足低功耗、小尺寸需求;
  • 智能家居设备(智能门锁、灯泡)的射频控制电路:实现远程信号隔离与传输。

3. 汽车电子射频

  • 汽车遥控钥匙、胎压监测系统(TPMS)的射频模块:作为信号隔离元件,提升抗干扰能力(需确认是否符合车规,台庆部分产品支持车规认证)。

五、使用注意事项

为确保性能与可靠性,使用时需注意以下几点:

1. 电流与功率限制

  • 直流电流不得超过1A(持续负载),脉冲电流需参考官方脉冲规格;
  • 最大直流功耗不超过0.2W,避免发热导致封装变形。

2. 焊接工艺要求

  • 采用回流焊,温度曲线符合0402标准:峰值245℃~260℃,回流时间<30s;
  • 手工焊接用恒温烙铁(<350℃),焊接时间<3s,避免损伤焊盘。

3. 存储与防护

  • 未使用器件存储在干燥环境(湿度<60%),温度-5℃~40℃;
  • 开封后1个月内使用,受潮需120℃烘烤4~8小时。

4. 阻抗匹配

  • 若电路阻抗为50Ω,需搭配电容/电阻组成匹配网络,避免信号反射。

总结

HCB1005KF-301T10是一款高性价比片式射频扼流圈,以小尺寸、低损耗、高可靠性为核心优势,覆盖多领域射频应用。用户需根据电路需求(电流、频率、阻抗)选择,并遵循官方规范,确保电路稳定。

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