WMSIC Electronic Components

Taiwan Lu Hai SMD0805-005-33V SMD0805

ModelSMD0805-005-33V
Package0805
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SMD0805-005-33V
Type
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SMD0805-005-33V
Electronic Component
1
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.025g
Electronic Component
1
Electronic Component
500ms
Electronic Component
BM0264398961
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
500mW
Current(Imax)
100A
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD0805-005-33V 自恢复保险丝(PTC)——产品概述

SMD0805-005-33V 是台湾陆海出品的一款用于表面贴装的小型自恢复聚合物正温度系数(PTC)过流保护器件,采用通用 0805 封装,专为空间受限、需可靠短路/过流保护的消费电子、通讯及工业类电路设计。器件在过流时迅速提高阻值以限制电流,故障消除后可自动恢复初始阻值,便于重复使用、降低维护成本。

一、主要电气与环境参数

  • 最大耐压(Vmax):33 V(连续电压不可超过此值)
  • 最大承受电流(Imax):100 A(短时冲击能力,需在制造商规定的脉冲条件下使用)
  • 保持电流(Ihold):50 mA(在标称环境温度下可长期不触发的最大电流)
  • 跳闸电流(Itrip):200 mA(在指定条件下器件在限定时间内开始进入高阻态)
  • 跳断动作时间:500 ms(在达到触发电流时的典型响应时间)
  • 初始态阻值(Rmin):2 Ω(常温、未触发时的典型阻抗)
  • 跳断后阻值上限(R1max):10 Ω(进入保护态后阻值可上升至此值或更高)
  • 额定消耗功率(Pd):500 mW(长期稳态下设备允许的最大功耗)
  • 工作温度范围:-40 ℃ ~ +85 ℃

二、产品特性与优势

  • 小体积:0805 封装便于在高密度 PCB 上节省空间,适合便携设备与模块化设计。
  • 自恢复:过流或短路解除后自动复位,减少更换次数并降低维修成本。
  • 宽工作温度:适应大多数室内/工控环境。
  • 可靠保护:对瞬态冲击与持续过流提供有效限流,保护下游电路与敏感器件。
  • SMT 兼容:支持常规回流焊工艺,便于自动化贴装与批量生产。

三、应用场景建议

  • USB、外围接口的过流保护(USB 供电系统通常 ≤ 20 V,33 V 上限可覆盖多种接口)
  • 模块化电源输入和小功率电源轨保护
  • 电池管理与充电线路(需注意系统最大电压与脉冲条件)
  • 通信设备、IoT 终端、便携式医疗/测量设备等需要重复保护但空间受限的场合

四、典型计算与选型注意事项

  • 电压降示例:在保持电流 Ihold=50 mA、Rmin=2 Ω 时,电压降≈0.05 A × 2 Ω = 0.1 V,功耗≈5 mW,远低于 Pd(500 mW),正常工作时自热很小。
  • 触发态示例:在 Itrip=200 mA 时,初始电压降≈0.2 A × 2 Ω = 0.4 V,功耗≈80 mW;进入保护后阻值可上升至 10 Ω,此时电压降和限流效果显著。
  • 余量选择:常规设计中,应将设备的持续工作电流留有足够余量(建议工作电流 ≤ 0.7 × Ihold),并考虑高温时 Ihold 会下降,应按最高工作环境温度修正选择。
  • 耐压限制:设备最大耐压 33 V,电路工作电压需低于此值(包含瞬态和反向电压余量),高压环境请选用更高耐压器件或并联其他保护措施。
  • 峰值冲击:标注的 Imax 为短时脉冲能力,具体次数和脉冲宽度需参照制造商详细脉冲曲线,切勿将其视为可持续电流。

五、封装与焊接建议

  • 支持标准 SMT 回流工艺;请遵从制造商提供的回流焊温度曲线及最大峰值温度。
  • 贴片时采用对应 0805 阵列的焊盘设计,合理分配焊盘尺寸与过孔以控制热量散布。
  • 对于高功耗场合,考虑 PCB 铜箔面积与散热路径以降低器件结温,避免长期工作温度过高导致触发电流变化。

六、测试与可靠性验证

  • 建议在目标系统上进行实际电流-时间曲线测试(I–t)以确认触发与恢复特性满足需求。
  • 在高温、低温与湿热环境下验证 Ihold/Itrip 的漂移与重复触发性能,确保长期可靠性。
  • 对于关键应用,进行寿命测试(多次触发/恢复循环)以评估性能退化。

总结:SMD0805-005-33V 以其小体积、自恢复特性和适中的电气参数,适合用于多种低压(≤33 V)系统的过流保护。在设计时请合理留余量并结合温度与冲击脉冲特性做验证,方能发挥最佳保护效果。若需更详细的脉冲曲线、回流焊工艺参数或封装信息,请联系台湾陆海或查阅厂商数据手册。

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