WMSIC Electronic Components

UNI-ROYAL 0805W8F5101T5E

Model0805W8F5101T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F5101T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F5101T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.031g
Electronic Component
5.1kΩ
Electronic Component
1
Electronic Component
BM0257245102
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F5101T5E 产品概述

一、产品简介

0805W8F5101T5E 为 UNI-ROYAL(厚声)系列的贴片厚膜电阻,封装为0805(2012公制),标称阻值 5.1 kΩ,公差 ±1%。该器件以厚膜工艺制成,适用于要求中等阻值精度与可靠性的表面贴装电路。凭借耐高温范围和稳健的电气特性,适合工业级与通用电子产品的阻值元件需求。

二、主要电气参数

  • 型号:0805W8F5101T5E
  • 阻值:5.1 kΩ
  • 精度:±1%(典型 1% 容差)
  • 封装:0805(尺寸≈2.0×1.25 mm,公制2012)
  • 功率额定:125 mW(常见0805厚膜额定)
  • 最高工作电压:150 V
  • 温度系数(TCR):±100 ppm/°C
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 工艺类型:厚膜(贴片电阻)

这些参数表明该型号在一般分压、偏置和信号路径等应用中能提供稳定的阻值和良好的温度追踪能力,但对于需要极低温漂(如 ±25 ppm/°C 以下)或高精度参考的场合,应优先考虑金属膜或薄膜精密电阻。

三、性能与可靠性

  • 温度稳定性:±100 ppm/°C 的 TCR 表明器件在温度变化时阻值变化受控,适合多数工业和消费类应用;长期高温工作时需考虑漂移累积效应并做适当降额设计。
  • 热可靠性:额定功率 125 mW 在封装和PCB散热条件允许下可靠工作,设计时建议参考供应商或应用手册进行功率与温升评估。
  • 机械与环境适应性:厚膜结构对常见的机械应力和湿热环境具有较好抵抗力;标准产品通常能通过焊接热循环、温度湿度循环和耐焊接试验(具体测试项以厂家资料为准)。
  • 失效模式:常见为阻值漂移、开路或焊点失效。为获得长期稳定性,应避免在接近功率极限与最高工作温度下长期使用。

四、典型应用场景

  • 通用电子设备的分压、偏置及限流电路
  • 信号处理前端的阻抗匹配与滤波网络
  • 工业控制、通讯设备与测量仪器中的通用电阻元件
  • 需要中等精度(1%)及良好温度特性的应用场合

注意:若用于安全关键、精密测量或需符合特定汽车/军事标准的应用,应确认供应商是否提供相应资格(如 AEC‑Q、MIL)和额外测试报告。

五、封装、焊接与存储建议

  • 封装与安装:0805 尺寸便于自动贴装;推荐按厂商或IPC建议的焊盘设计与过孔布局以优化焊接质量与热散。
  • 焊接工艺:兼容常用无铅回流焊流程;实际回流曲线应以供应商推荐为准,避免过度热循环或瞬时过高峰值温度以防造成电阻热应力。
  • 降额与热管理:在设计中应考虑环境温度与PCB散热能力,对应降低允许工作功率以提高寿命;长期高温运行会加速阻值漂移。
  • 存储与包装:器件通常以卷带(reel)形式供货,储存环境避免高温、高湿及污染,开卷后尽快使用以免焊接性能受影响。如需具体包装数量与防潮等级,请向供应方确认。

六、采购与质量保证建议

  • 在采购前请确认是否需要 RoHS/无铅合规证明或其他环保与可靠性认证;部分应用可能需索取批次检验报告、阻值分布与焊接性测试记录。
  • 若电路对温漂或长期稳定性有更高要求,可与供应商沟通是否提供更低 TCR 或更高可靠性等级的替代型号。
  • 建议在样机阶段进行实装与加速老化验证,评估实际 PCB 熔点、环境及应力条件下的性能变化。

总结:0805W8F5101T5E 为一款通用型厚膜贴片电阻,具备 5.1 kΩ ±1% 的精度、125 mW 功率额定与 ±100 ppm/°C 的温漂特性,适用于多种工业和消费电子电路中的常规阻值应用。选择时应结合具体热环境与精度需求进行适当降额与可靠性验证。

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