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UNI-ROYAL 0402WGF5601TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF5601TCE
- Type
- 0402
- Minimum package
- 10000
Technical parameters
- Power
- 62.5mW
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF5601TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 5.6kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257341481
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF5601TCE 产品概述
一、产品简介
0402WGF5601TCE 是 UNI-ROYAL（厚声）推出的厚膜贴片电阻，封装为 0402（1005 公制）。额定功率 62.5 mW，阻值 5.6 kΩ，精度 ±1%，温度系数（TCR）±100 ppm/℃，额定工作电压 50 V，工作温度范围 -55℃ 至 +155℃。该器件以小尺寸、高密度贴装为特点，适合空间受限且对稳定性有中等要求的低功率设计场合。
二、主要性能参数（要点）
- 电阻类型：厚膜（Thick Film）贴片电阻
- 封装：0402（1005）
- 标称阻值：5.6 kΩ
- 精度：±1%
- 额定功率：62.5 mW（环境温度与散热条件影响实际可用功率）
- 额定工作电压：50 V
- 温度系数：±100 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 品牌：UNI-ROYAL（厚声）
三、性能特点与适用场景
该系列为厚膜工艺，具备成本效益高、批量一致性好、适应自动贴装生产线的优点。±1% 精度与 ±100 ppm/℃ 的温漂使其在一般精度要求的分压、电阻网络、滤波前置阻抗及偏置电路中表现良好。由于封装极小，适用于智能终端、消费电子、便携设备、物联网模块以及其他对 PCB 面积敏感的低功耗电路。
四、封装与焊接注意事项
- 0402 封装尺寸微小，贴装时建议使用精确的 PCB 焊盘设计与自动点胶/回流工艺，避免飞片或偏位。
- 回流焊温度曲线应遵循焊料与装配工艺规范，避免过高峰值温度或长时间高温暴露，以保护电阻的稳定性。
- 贴装、测试与波峰焊（如使用）时应避免对器件施加机械冲击或过度弯曲 PCB。
- 建议在设计时考虑热量分散与功率降额，保证在最高工作温度下器件不过载。
五、可靠性与品质控制
厚声产品通常通过一系列常规可靠性试验（如耐焊性、湿热、热冲击、负载寿命等）以验证在规范工况下的长期稳定性。实际应用中建议参考厂商完整 Datasheet，关注额定功率随环境温度的降额曲线、最大脉冲能量及长期负载寿命数据，以确保设计裕量满足目标用途。
六、选型与采购建议
- 使用前请向供应商索取最新 Datasheet 与可靠性报告，确认所有电气与环境参数满足系统要求。
- 若电路存在较大瞬态电压、浪涌或更严格的温漂/精度要求，可考虑更高功率、更低 TCR 或金属膜/薄膜等替代方案。
- 订购时确认包装形式（卷带/盘）、出货批次与检验条件；如需认证（如 RoHS、AEC‑Q 等）请提前与厂商沟通。
如需我帮您整理更详细的 Datasheet 要点对照表、PCB 焊盘推荐尺寸或与同类封装/精度的替代型号比较，请告知用途与关键要求，我可以进一步协助。
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