Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0805W8J0221T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8J0221T5E
- Type
- 0805
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8J0221T5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.027g
- Electronic Component
- 220Ω
- Electronic Component
- 1
- Electronic Component
- BM0257341740
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8J0221T5E 产品概述
一、产品简介
0805W8J0221T5E 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，封装为 0805（公制 2012，约 2.0 mm × 1.25 mm）。标称阻值 220Ω，精度 ±5%（J），额定功率 125 mW（0.125 W），适用于对成本与体积有要求的中低功率电子产品。
二、主要技术参数
- 电阻类型：厚膜（Thick film）
- 阻值：220Ω ±5%
- 额定功率：125 mW
- 允许工作电压：150 V（Max）
- 温度系数（TCR）：±100 ppm/℃（约 0.01%/℃）
- 工作温度范围：-55℃ ~ +155℃
- 封装：0805（贴片）
三、产品特点
- 体积小、成本低，适合大批量生产与贴片工艺；
- 良好的通用稳定性，满足一般消费类与工业类电路要求；
- 宽温区工作能力，可在低温与中高温环境下稳定工作；
- 标称电压较高（150 V），在高电压、低电流场景具有一定应用空间。
四、典型应用场景
适用于家电、消费电子、照明驱动、接口电路、分压/限流、上拉/下拉、滤波阻抗网络等。由于功率为 125 mW，推荐用于低功耗限流、信号级定值及保护元件，避免在高功率、持续发热场合直接使用。
五、封装与焊接建议
- 兼容常用贴片回流焊流程；为保证可靠性，建议遵循供应商推荐的回流曲线（控制升温速率、峰值温度与停留时间）；
- 焊盘设计建议参考 0805 封装标准，保持良好焊膏量与焊接均匀性；
- 芯片附近尽量避免紧邻大功耗发热元件，利于散热与延长寿命。
六、可靠性与存储
- 建议在干燥、常温、避光环境中保存，避免潮湿与化学污染；
- 出厂前一般经过耐焊接热、机械冲击、恒定湿热及负载寿命等常规可靠性测试；具体项目与寿命数据请参照厂商完整规格书。
七、选型与注意事项
- 使用时按额定功率与环境温度进行降额设计，避免长期在额定功率附近运行；
- 对温度敏感或要求高稳定性的场合，建议选用更低 TCR（如 ±50 ppm/℃ 或更好）或金属膜产品；
- 订购与包装（卷带/盘带）请以供应商实际资料为准，必要时向 UNI-ROYAL 索取完整数据表与可靠性报告以便设计验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
