WMSIC Electronic Components

UNI-ROYAL 0402WGJ0203TCE

Model0402WGJ0203TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGJ0203TCE
Type
0402
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGJ0203TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
20kΩ
Electronic Component
10
Electronic Component
BM0257342224
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGJ0203TCE 产品概述

一、产品简介

0402WGJ0203TCE 是 UNI-ROYAL(厚声)系列的一款厚膜贴片电阻,封装尺寸为 0402(公制 1005),标称阻值 20kΩ,阻值精度 ±5%,额定功率 62.5mW,额定工作电压 50V。该器件采用厚膜工艺制程,具有成本低、批量一致性好、适用于常规电子设备的特点,工作温度范围 -55℃ 至 +155℃,温度系数(TCR)典型值 ±100ppm/℃。

二、主要性能参数

  • 电阻类型:厚膜贴片电阻
  • 封装:0402(1005)
  • 标称阻值:20kΩ
  • 阻值精度:±5%(J级)
  • 额定功率:62.5mW(在规定环境条件下)
  • 最大工作电压:50V
  • 温度系数:±100ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 品牌:UNI-ROYAL(厚声)

三、产品特性与优势

  • 小尺寸(0402),适合高密度 PCB 布局,节省版面空间;
  • 厚膜工艺成本优势明显,适合大批量商用电子产品;
  • 宽温工作范围,适用于工业级及一般军规温度环境;
  • TCR ±100ppm/℃ 能满足多数模拟电路、偏置与分压网络对温度稳定性的需求;
  • 标称功率 62.5mW 在小尺寸元件中兼顾功率与热稳定性,适用于低功率回路。

四、典型应用场景

  • 移动终端、便携式设备的偏置与分压电路;
  • 工业控制与传感器信号调理;
  • 家用电器的控制板、驱动电路;
  • 通信设备、网络产品中的通用阻值需求;
  • 各类消费电子和测量仪器的常规电阻件替换与 BOM 标配。

五、使用与设计建议

  • 功率与热管理:建议在 PCB 设计时为该器件预留适当的铜箔面积以利散热;在高环境温度下应按厂家热降额曲线进行功率降额(避免长期在额定功率下高温工作)。
  • 电压限制:实际电压应不超过 50V,以避免击穿或电阻值漂移。
  • 回流焊兼容性:支持标准回流焊工艺。推荐回流温度峰值 ≤ 260℃,预热 150180℃,峰值保温时间 1030 秒(依据具体锡膏与工艺参数调整)。
  • 机械应力:贴装时避免对器件施加过大的剪切或弯曲力,防止端接电极裂纹导致失效。
  • 清洗与存储:可按常规贴片元件工艺清洗,避免长期潮湿环境存储,未使用元件建议密封干燥存放。

六、可靠性与检验建议

  • 在设计验证阶段建议做热循环、湿热与焊接应力试验以评估在目标应用中的长期稳定性;
  • 对关键电路可采用样机运行测试来确认阻值漂移与功耗适配;
  • 若应用于严格高可靠性场合,应与供应商确认通过的可靠性测试标准与报告。

七、选型与订购提示

  • 型号中 0402 明确封装规格,WGJ0203TCE 为厂商内部型号,请在下单时确认完整料号、阻值与封装一致;
  • 需批量采购时建议与供应商确认供货周期、批次一致性以及可提供的合格证(COC)或检验报告。

如需该型号的样片测试参数、真实电阻-温度曲线或详细回流曲线建议,我可继续协助向供应链或厂家资料库查询并整理详尽资料。

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