WMSIC Electronic Components

UNI-ROYAL 0603WAF6803T5E

Model0603WAF6803T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF6803T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF6803T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
680kΩ
Electronic Component
1
Electronic Component
BM0257245635
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF6803T5E 产品概述

一、主要参数

  • 型号:0603WAF6803T5E
  • 品牌:UNI-ROYAL(厚声)
  • 阻值:680 kΩ
  • 精度:±1%
  • 电阻类型:厚膜贴片电阻(Thick film)
  • 功率额定:100 mW(在基准环境下)
  • 最高工作电压:75 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:0603(约 1.6 mm × 0.8 mm)
  • 外观/封装形式:SMT 贴片,适配常规卷带装(适合自动贴片机)

二、产品特点

  1. 精度高:±1% 的阻值公差能够满足多数精密分压、电平设定和基准网络的要求。
  2. 小型化:0603 封装体积小、占板面积小,适合高密度 PCB 布局与微型化产品设计。
  3. 温度稳定性适中:±100 ppm/℃ 的温度系数在工业级和消费电子多数应用中表现稳定。
  4. 合理的功率与电压等级:100 mW 的额定功率配合 75 V 的工作电压,适合大多数低功耗、高阻值场合。
  5. 成本与可加工性:厚膜工艺具有成本优势,且与常规回流焊、波峰焊工艺兼容,易于量产。

三、典型应用场景

  • 高阻抗电路:输入偏置、放大器输入网络、传感器高阻抗信号链路。
  • 分压器与参考电路:需要精确分压但电流要求较低的场合。
  • 拉高/拉低电阻:微控制器的上拉或下拉、逻辑门的静态电平设定。
  • 仪器仪表与测量设备:对阻值稳定性和精度有一定要求的测量通道。
  • 可穿戴、移动设备:体积受限且对功耗/尺寸有更高要求的产品。

四、设计注意事项与建议

  1. 功率与降额:标称 100 mW 为参考值;在高环境温度时需按厂家降额曲线处理,避免长期在额定功率附近工作。
  2. 电压与电阻值配合:680 kΩ 为高阻值,推挽电流极小但对表面泄漏电流、环境湿度敏感;且 75 V 的最高工作电压限制必须遵守,以避免绝缘击穿或电阻元件损坏。
  3. 温漂影响:±100 ppm/℃ 的 TCR 在大温度变化环境下仍会引起显著的阻值偏移,应在精密测量或高精度比率要求下进行温度补偿或选择更低 TCR 的器件。
  4. 噪声与稳定性:厚膜电阻在高阻值区间相对会有较高的热噪声与电压系数效应;用于极微弱信号链路时建议评估噪声影响或考虑金属膜/薄膜替代品。
  5. 潮湿与保养:高阻值电阻对潮湿更敏感,应在 PCB 设计时避免与导电胶或潮湿源直接接触,并可在敏感区域采用防潮涂层或封装保护。

五、焊接与工艺建议

  • 适用于常规 SMT 回流焊工艺;建议遵循无铅回流推荐曲线和生产线实际能力。
  • 在回流焊前应控制包装和贴装环境以减少焊接缺陷;回流后应避免剧烈机械应力。
  • 贴装时推荐使用与 0603 尺寸匹配的焊盘,避免过大或过小焊盘导致的焊锡桥或焊点不良。
  • 对于电阻的最终可靠性测试,建议进行湿热、温度循环和焊接后老化验证。

六、可靠性与质量检验

  • 常规出厂检验包括阻值与容差测试、绝缘与耐压测试、焊接性测试以及环境应力测试(高低温、湿热、热冲击等)。
  • 长期漂移与老化:厚膜电阻存在一定老化效应,特别是在高功率或高温环境下,必要时建议进行寿命评估或使用更高等级器件。

七、选型与替代方案

  • 若应用对温漂、噪声或长期稳定性要求更严格,可考虑薄膜或金属膜低 TCR 电阻。
  • 若工作电压或功耗超过本器件额定范围,应采用更大封装或具有更高功率/电压等级的型号。

八、包装与订购建议

  • 本型号通常提供卷带式包装,方便高速贴装。订购时请确认包装单位、出货批号及规格书以确保一致性。
  • 在批量生产前建议索取样品并进行工艺与环境适配性验证。

如需更详细的电气曲线、降额图或可靠性测试报告,请联系供应商或参阅 UNI-ROYAL 官方技术资料。

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