WMSIC Electronic Components

UNI-ROYAL 0402WGF1801TCE

Model0402WGF1801TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF1801TCE
Type
0402
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF1801TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
1.8kΩ
Electronic Component
10
Electronic Component
BM0257242572
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF1801TCE 产品概述

一、产品简介

0402WGF1801TCE 是 UNI-ROYAL(厚声)出品的一款 0402 封装厚膜贴片电阻。标称阻值 1.8kΩ,精度 ±1%,额定功率 62.5mW,额定工作电压 50V。工作温度范围宽,-55℃ 至 +155℃,温度系数(TCR)为 ±100ppm/℃,适合高密度、对尺寸要求严格的表面贴装电路。

二、主要性能特点

  • 封装:0402(约 1.0mm × 0.5mm),体积小、适合高密度布板。
  • 阻值与精度:1.8kΩ,公差 ±1%,适用于精密分压、参考与滤波电路。
  • 功率与电压:额定功率 62.5mW,最高工作电压 50V,需在允许的功耗范围内使用并留有热裕量。
  • 热稳定性:TCR ±100ppm/℃,在常见温漂要求下表现稳定。
  • 温度耐受:-55℃~+155℃,适用于工业级环境。

三、典型应用场景

  • 移动通信、消费电子中的信号处理与分压电路。
  • 模拟前端、AD/DA 输入阻抗匹配、滤波器与偏置电路。
  • IoT、可穿戴设备和便携式终端中对体积与精度有要求的低功耗场合。
  • 不适合用于高功耗、散热受限或大电流场合。

四、装配与使用建议

  • 采用常规回流焊工艺贴装,推荐遵循厂家的焊接曲线和温度上限,避免过高峰值温度或过长加热时间以保可靠性。
  • 由于封装小且功率低,布局时尽量避免靠近高热源元件,必要时为其留出散热空间或采用铜箔散热设计。
  • 在设计电路时考虑功率余量与升温:连续工作时实际可用功率会随环境温度和 PCB 散热条件降低。
  • 储存与搬运时防潮防尘,避免受潮影响焊接性与长期可靠性。

五、可靠性与环境适配

  • 厚膜结构具备良好的抗震动与抗冲击性能,适合通用工业环境。
  • 在高湿、高盐雾或强腐蚀环境下建议进行额外防护或选用专用防护涂层元件。
  • 长期稳定性受焊接温度、工作电压和环境温度影响,设计时应考虑寿命退化。

六、包装与采购

0402WGF1801TCE 通常以卷带(Tape & Reel)方式供货,便于贴片机自动化加工。采购时请确认所需数量、包装规格与品质等级,并向供应商索取完整的规格书(Datasheet)以便获得精确的焊接曲线与可靠性测试数据。

备注:本概述基于产品基础参数与工业通用经验给出,具体应用与设计请参考厂商规格书并在关键应用中进行实测验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.