Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0402WGF3653TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF3653TCE
- Type
- 0402
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF3653TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 365kΩ
- Electronic Component
- 50
- Electronic Component
- BM0263477300
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF3653TCE厚膜贴片电阻产品概述
一、产品基本属性
0402WGF3653TCE为UNI-ROYAL（厚声） 品牌旗下的厚膜贴片电阻，采用行业标准0402封装（尺寸约1.0mm×0.5mm），属于小体积高密度贴片电阻范畴。
型号解析：
- “0402”：明确封装规格（英制代码，对应公制1.0×0.5mm）；
- “WGF”：关联功率/精度等级（匹配62.5mW功率与±1%精度）；
- “3653”：三位数字阻值表示法（365×10³Ω=365kΩ）；
- “TCE”：后缀对应温度系数（±100ppm/℃）与封装特性。
作为厚膜电阻，其通过丝网印刷、高温烧结工艺制备，兼具稳定性与成本优势，是消费电子、工业控制等领域的常规选型元件。
二、核心性能参数详解
该产品的关键参数可覆盖多数中低功耗电路需求，具体如下：
参数类型 规格值 说明 标称阻值 365kΩ 三位数字法（365×10³），实际阻值±1% 精度等级 ±1% 满足一般信号调理、分压电路误差要求 额定功率 62.5mW 0402封装典型功率，适配小信号电路 额定工作电压 50V 使用时需结合降额设计（峰值不超额定值） 温度系数（TCR） ±100ppm/℃ 温度每变化1℃，阻值变化≤±0.01% 工作温度范围 -55℃~+155℃ 宽温区覆盖工业/汽车级环境需求三、设计特点与应用优势
- 小体积高密度：0402封装仅1.0×0.5mm，可提升PCB集成度，适配便携式电子、穿戴设备等空间苛刻场景；
- 宽温区稳定性：±100ppm/℃的TCR与-55~+155℃温区，使产品在极端温度下阻值波动极小，满足工业现场、车载环境需求；
- 厚膜工艺优势：高温烧结形成的电阻膜与陶瓷基底结合紧密，抗浪涌能力强，长期使用阻值漂移≤0.5%（1000小时老化后）；
- 成本与性能平衡：±1%精度覆盖80%以上常规电路需求，无需额外选用高精度电阻，降低设计成本。
四、典型应用场景
该产品因参数匹配性，广泛应用于以下领域：
- 便携式电子：智能手机、智能手环的信号调理电路（利用小体积实现紧凑设计）；
- 工业控制：PLC输入输出模块、传感器信号放大电路（宽温区适配现场温度波动）；
- 电源滤波：DC-DC转换器输出滤波网络（62.5mW功率满足小信号滤波需求）；
- 汽车电子：车载显示屏背光控制、传感器接口电路（温区覆盖舱内外温度变化）；
- 消费配件：蓝牙耳机、充电器分压电路（±1%精度保证电压输出稳定）。
五、可靠性与环境适应性
- 工艺可靠性：符合IEC 60115-1电阻器标准，抗机械振动、冲击能力强（振动测试：10~2000Hz，加速度1g）；
- 环境耐受性：耐湿性能符合JESD 22 A101标准（湿度60℃/95%RH，1000小时后阻值变化≤1%）；
- 长期稳定性：额定条件下1000小时老化，阻值漂移≤0.5%，满足设备长期运行需求。
总结
0402WGF3653TCE厚膜贴片电阻凭借小体积、宽温区、稳定性能等特点，成为多领域电路设计的常规选型元件，可有效平衡性能、成本与空间需求，适配从消费电子到工业控制的多样化场景。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
- QFN-80
