WMSIC Electronic Components

UNI-ROYAL 0805W8J0223T5E

Model0805W8J0223T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8J0223T5E
Type
0805
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8J0223T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.027g
Electronic Component
22kΩ
Electronic Component
10
Electronic Component
BM0257342338
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8J0223T5E 产品概述

一、产品简介

0805W8J0223T5E 是 UNI-ROYAL(厚声)系列的一款厚膜贴片电阻,阻值 22kΩ,精度 ±5%(J),额定功率 0.125W(125mW),适用常规表面贴装(0805)电子组装。该产品以成本效益高、可批量回流焊接和环境温度范围宽为特点,适合多种通用电子设备中作为分压、限流、上拉/下拉等用途的元件选择。

二、主要参数

  • 电阻类型:厚膜电阻
  • 阻值:22kΩ
  • 精度:±5%(J)
  • 额定功率:125mW(在参考环境温度下)
  • 最高工作电压:150V
  • 温度系数(TCR):±100ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0805(约 2.0 × 1.25 mm)
  • 品牌:UNI-ROYAL(厚声)

三、性能特性

  • 稳定性:厚膜工艺在一般商业及工业环境下具有良好的长期稳定性,适合对成本敏感但对精度要求不极端苛刻的场合。
  • 温度特性:TCR ±100ppm/℃,温漂属于中等水平,适用于温度变化不剧烈或对阻值漂移容忍度较高的电路。
  • 耐压能力:标称工作电压 150V,可满足多数中低压信号与电源分压器的使用要求。
  • 电噪声:厚膜电阻相较金属膜电阻噪声稍高,不推荐用于极低噪声模拟前端或高精度测量放大电路。

四、封装与安装建议

  • 0805 尺寸适配业内常用贴片工艺,便于高速自动贴装与回流焊接。
  • 建议按厂家提供的回流焊曲线进行焊接,避免反复高温回流超过规定次数以减小阻值漂移。
  • 焊接前后应避免机械应力集中在电阻本体;在 PCB 布局时留有合理焊盘、焊膏量及应力释放空间,以提高可靠性。

五、典型应用场景

  • 消费电子:电视机、机顶盒、家电控制板等通用电路中常见的分压、上拉/下拉和限流用途。
  • 工业控制与仪表:用于抗干扰要求不高的信号处理、滤波网络和逻辑电平整形。
  • 电源与驱动:低功率分压、电压检测网络(在电压和精度允许范围内)。
  • 通讯与网络设备:作为通用匹配与偏置元件使用。

六、储存与可靠性

  • 储存环境应避免潮湿、盐雾及腐蚀性气体;长期储存应保持原包装以防端接氧化。
  • 在使用与装配过程中注意防止静电放电导致附加应力,尽量减少弯折和撞击。
  • 若用于关键或高可靠性场合,建议进行额外的温度循环和老化验证以确认满足系统寿命要求。

0805W8J0223T5E 以其通用尺寸和稳定的厚膜特性,适合大批量、成本敏感的电子产品设计。选择时请结合具体电路对精度、温漂与噪声的要求,并参考厂方最新版数据手册和推荐工艺。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.