WMSIC Electronic Components

UNI-ROYAL 0805W8F9101T5E

Model0805W8F9101T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F9101T5E
Type
0805
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F9101T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
9.1kΩ
Electronic Component
1
Electronic Component
BM0257628152
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F9101T5E 厚膜贴片电阻产品概述

0805W8F9101T5E是UNI-ROYAL(厚声) 推出的0805封装厚膜贴片电阻,针对中低端电子设备的常规电路需求设计,兼具成本优势与性能稳定性,广泛覆盖消费电子、工业控制、车载等领域。以下从多维度解析其核心特性与应用价值:

一、产品基本身份标签

该电阻的核心标识清晰明确,便于快速识别:

  • 品牌:UNI-ROYAL(厚声)——国内知名被动元器件厂商,产品以高性价比著称;
  • 类型:厚膜贴片电阻——采用丝网印刷+高温烧结工艺,平衡成本与性能;
  • 型号编码:0805(封装尺寸)+ W8(1/8W功率)+ F(±1%精度)+ 9101(9.1kΩ阻值);
  • 封装规格:0805(英制,对应公制2012)——尺寸为2.0mm×1.25mm,适配SMT自动贴装线,生产效率高。

二、核心性能参数深度解析

关键参数直接决定应用边界,需重点关注:

1. 阻值与精度

  • 阻值:9.1kΩ(9100Ω),采用标准数字代码标识;
  • 精度:±1%——处于“常规精准”区间,既满足消费电子、工业设备的信号处理基本需求,又比±5%精度电阻的应用场景更广泛(如避免阻值偏差导致的信号失真)。

2. 功率与电压额定值

  • 额定功率:125mW(1/8W)——长期工作时的最大允许功耗,实际应用需确保电路中该电阻功耗≤此值(如电流上限≈3.7mA);
  • 工作电压:150V——短时间过压耐受力(长期工作需控制电压≤√(0.125×9100)≈33.7V),适配瞬态电压冲击场景。

3. 温度特性

  • 温度系数(TCR):±100ppm/℃——温度每变化1℃,阻值变化±0.01%;100℃温差下阻值变化±1%,与精度范围匹配,适合温度波动较大的场景;
  • 工作温度范围:-55℃~+155℃——覆盖工业级温度标准,可满足北方冬季户外、工业控制柜高温等极端环境。

三、封装与工艺优势

1. 0805封装的适配性

  • 小型化:体积小,节省PCB空间,适合高密度电路设计(如智能手机主板);
  • 贴装兼容性:适配绝大多数SMT贴片机,降低人工成本;
  • 散热性:125mW额定功率无需额外散热,满足常规电路需求。

2. 厚膜工艺的性价比

相比薄膜电阻成本更低,比碳膜电阻精度更高(±1% vs ±5%)、温度稳定性更好,适合批量应用。

四、典型应用场景

结合参数特性,该电阻适用于以下场景:

  1. 消费电子:手机音频分压、电视电源滤波、遥控器按键限流;
  2. 工业控制:PLC模拟量输入分压、传感器信号调理(如温度/压力传感器接口);
  3. 车载电子:仪表盘LED背光驱动、车载音响信号衰减(温度稳定性适配车内温差);
  4. 通信设备:路由器/交换机电源滤波、信号衰减(小型化适配高密度PCB)。

五、可靠性与选型建议

1. 可靠性指标

  • 符合RoHS 2.0环保标准(无铅、无镉等有害物质);
  • 耐湿热(85℃/85%RH环境1000小时阻值变化≤1%)、机械冲击(1000g冲击无开路)性能满足IPC标准;
  • 额定功率下工作1000小时,阻值变化≤0.5%,性能稳定。

2. 选型与替代

  • 选型要点:实际功耗≤125mW,若需更高功率可换0805封装1/4W电阻;
  • 替代方案:国巨0805F9101、风华0805-9101(同参数)可直接替代,需确认温度系数匹配。

总结

0805W8F9101T5E厚膜贴片电阻以成本适中、性能稳定、封装小型化、温度范围宽为核心优势,覆盖中低端电子设备的常规电路需求,是批量生产的理想选择。其±1%精度与±100ppm/℃TCR平衡了性能与成本,适配消费电子、工业控制等多领域应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.