WMSIC Electronic Components

UTC 2SB649AG-C-AB3-R 2SB649AG

Model2SB649AG-C-AB3-R
PackageSOT-89
BrandUTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UTC 2SB649AG-C-AB3-R
Type
UTC
Minimum package
4000

Technical parameters

Electronic Component
UTC
Electronic Component
2SB649AG-C-AB3-R
Electronic Component
1
Package
SOT-89
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.144g
Electronic Component
1
Electronic Component
BM0227112606
Transistor Type
PNP
Frequency(f T)
140MHz
Power Dissipation(Pd)
500mW
Electronic Component
4000
Collector Current(Ic)
1.5A
Current (h FE)
100
Voltage(Vebo)
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SB649AG-C-AB3-R 产品概述

一、基本介绍

2SB649AG-C-AB3-R 是 UTC(友顺)出品的一款 PNP 低功耗高压晶体管,封装为 SOT-89(SOT-89-3)。该器件适用于需要中等电流、较高耐压与中频特性的模拟放大与开关场合,兼顾体积小、安装方便与一定的功耗能力,适合小型线性电路与高侧开关驱动。

二、主要电气参数(典型/额定)

  • 直流电流增益 hFE:100(测试条件 150mA、VCE=5V)
  • 集电极电流 Ic:最高 1.5A
  • 集电极-射极击穿电压 Vceo:160V(高压等级,适合高压应用)
  • 耗散功率 Pd:500mW(SOT-89 封装的热限制)
  • 特征频率 fT:140MHz(中高频特性,适合小信号放大)
  • 集电极截止电流 Icbo:10µA(低漏电,适合高阻态应用)
  • 射基极击穿电压 Vebo:5V(注意基-射极反向电压限制)
  • 集-射饱和电压 VCE(sat):约 1V(在饱和驱动下的典型值)

三、特性亮点与应用场景

  • 高耐压(Vceo = 160V):适合高压小功率线性放大、开关电源次级或高压驱动电路。
  • 中等电流能力(Ic up to 1.5A)但功耗受限(Pd = 500mW):适用于低功耗功率放大、驱动小型继电器/负载、保护电路等。
  • 高频性能良好(fT = 140MHz):适合频带内的模拟放大器与射频前端小信号处理(注意功率限制)。
  • PNP 结构:便于用作高侧开关、正电源侧驱动或与 NPN 器件做互补放大级。

典型应用包括:音频小信号放大、前级驱动、高侧开关、低功耗线性稳压器、传感器接口与小型电源管理电路。

四、使用建议与注意事项

  1. 饱和与开关驱动:若用于开关或饱和导通,推荐采用“强制 β”(例如 βf = 1020)来保证饱和,计算基极驱动电流 Ib ≈ Ic / βf。举例:要开 150mA,Ib 建议取 1015mA。
  2. 基-射极反向限制:Vebo = 5V,禁止在电路中产生超过该值的反向电压以免损坏结。
  3. 热管理:SOT-89 的 Pd 为 500mW,实际使用时应留有热余量并做功率降额处理。建议在 PCB 设计中使用较大铜箔与散热过孔改善热阻,避免长期接近最大耗散功率。
  4. 防静电与焊接:器件应按常规半导体防静电措施处理,遵循推荐焊接温度曲线,避免过热导致参数漂移或封装应力。

五、封装与机械特性

SOT-89 三引脚小型封装,具有比 SOT-23 更好的散热能力和更高的功耗承受度,便于手工焊接与自动贴装。引脚排列适合 PCB 上的散热铜地或热垫连接,推荐参考厂家封装图与焊盘尺寸进行布局。

六、选型建议与替代

  • 若需要更高功耗承受或更大电流,应选择带有更低结壳热阻或大封装(例如 SOT-223、TO-220 类)器件。
  • 在寻找互补或替代型号时,应匹配 Vceo、Ic、hFE 与封装条件,必要时参考 UTC 的器件表或联系供应商获取精确互补型号与参数对照。

总结:2SB649AG-C-AB3-R 为一款面向中高压、低功耗场合的 PNP 小信号/驱动晶体管,适用性广,但在设计时需重视功耗与热管理、基极反向电压保护,以及根据应用选择合适的驱动策略。具体参数与封装细节请参照 UTC 正式数据手册以获得完整限值、典型曲线与 PCB 推荐图。

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