WMSIC Electronic Components

UTC U74AHC1G02G-AE5-R U74AHC1G02G

ModelU74AHC1G02G-AE5-R
PackageSOT-23-5
BrandUTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UTC U74AHC1G02G-AE5-R
Type
UTC
Minimum package
3000

Technical parameters

Electronic Component
UTC
Electronic Component
U74AHC1G02G-AE5-R
Electronic Component
1
Package
SOT-23-5
Electronic Component
Logic Gate
Electronic Component
74AHC
Electronic Component
0.034g
Electronic Component
1
Channel Count
1
Electronic Component
BM0230022095
Operating Temperature
40℃~+125℃
Operating Voltage
2V~5.5V
Logic Type
Gate
Channel Count
2
Static Current(Iq)
1uA
(tpd)
7.5ns@5V,50pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

U74AHC1G02G-AE5-R 产品概述

一、产品简介

U74AHC1G02G-AE5-R 为 UTC(友顺)推出的单路 2 输入“或非”门(NOR),隶属 74AHC 系列高速 CMOS 逻辑器件。器件工作电压范围宽:2.0V 至 5.5V,工作温度范围为 -40℃ 至 +125℃,适用于便携式、工业及汽车类宽温环境下的逻辑处理与接口电路。封装采用 SOT-23-5,极大节省 PCB 面积,便于空间受限应用。

二、关键电气性能

  • 供电电压:2.0 V ~ 5.5 V
  • 输入通道数:2(单门)/ 器件通道数:1
  • 静态电流(Iq):典型 1 μA(低静态功耗,适合电池供电系统)
  • 传播延迟(tpd):典型 7.5 ns @ 5 V, CL = 50 pF(适用于中高速逻辑链路)
  • 常见的输入/输出电平(在不同测试条件/供电电压下的典型值):
    • VIH:2.1 V;1.5 V;3.85 V
    • VIL:900 mV;500 mV;1.65 V
    • VOH:2.58 V;4.4 ~ 4.5 V;2.9 ~ 3 V;1.9 ~ 2 V;3.94 V
    • VOL:100 mV;360 mV
      注:上述多组电平为在不同 VCC 与负载条件下的典型/测试值,具体设计时请参照原厂数据手册中对应电压与负载条件下的限值。

三、主要特点与优势

  • 宽电源电压兼容,便于在 3.3 V 与 5 V 系统间使用。
  • 极低静态电流,有利于降低待机功耗与延长电池寿命。
  • 单门、SOT-23-5 封装,适合对占板面积与成本敏感的设计。
  • 良好的速度/功耗折衷:在 5 V、50 pF 负载下 7.5 ns 的传输延迟,满足多数控制与接口时序需求。
  • 宽温工作范围适合工业级及部分车规级应用(请结合完整数据手册确认可靠性与测试条件)。

四、典型应用

  • 多电平系统中的逻辑合成与信号判定(NOR 运算)
  • MCU/FPGA 外围逻辑、地址译码与控制信号生成
  • 低功耗便携产品、消费电子的逻辑接口
  • 工业控制、仪器仪表中的组合逻辑单元

五、布局与设计建议

  • VCC 引脚应靠近去耦电容(例如 0.1 μF)布置,以抑制瞬态噪声;去耦电容放置于器件电源与地之间,距离越近越好。
  • 输入端避免浮空,必要时使用上下拉电阻以定义默认电平,防止功耗增加或误触发。
  • 输出驱动能力随负载变化,设计时应考虑 VOH/VOL 在目标负载下的变化,必要时并行驱动器或缓冲器以改善驱动能力。
  • 避免将器件置于超出推荐电压或温度范围的环境,遵循原厂绝对最大额定值。

六、小结与获取资料

U74AHC1G02G-AE5-R 是一款面向空间受限、低功耗且需兼顾速度的单路 2 输入 NOR 门,适用范围广泛。为获得完整电气特性、引脚排列、绝对最大额定值及典型应用电路,请参考 UTC(友顺)原厂数据手册或联系供应商索取样片与规格说明。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.