Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LD1117AG-33-AB3-C-R 是一种高效的线性稳压器(LDO),专为需要稳定 3.3V 输出电压的应用而设计。该芯片支持输入电压高达 15V,并能够提供 1A 的最大输出电流,确保 في各种条件下的可靠性和稳定性。由于其优秀的调节性能与低噪声特点,使得 LD1117 在许多电子设备中得到了广泛应用。
固定输出电压:LD1117AG-33-AB3-C-R 提供稳定的 3.3V 输出,非常适合需要这一电源电压的微控制器、传感器和其他数字电路。
高输入电压范围:该器件能够在 1.25V 至 15V 的宽电压范围内工作,使其能够与多种电源兼容,提供灵活的设计能力。
高输出电流能力:最大输出电流可达 1A,满足绝大多数应用场景下的高功率需求,确保系统的高效运行。
低压差:其低压差特性(通常小于 1.2V),使得在输入/输出电压差异较小的情况下,仍能高效工作,提升系统整体能效。
功耗和发热控制:内部设计有过流保护和过热保护功能,使其在高负载情况下能够有效降低功耗与发热,为电路的长时间稳定运行提供保障。
小巧的封装尺寸:LD1117AG-33-AB3-C-R 采用 SOT-89 封装,体积小巧,适合于空间受限的电子设备,方便布局,减小系统整体体积。
由于其优异的性能特点,LD1117AG-33-AB3-C-R 广泛应用于多个领域,包括但不限于:
消费电子:如智能手机、平板电脑等便携式电子设备,LD1117 能够提供稳定的工作电压,保障设备的正常运行。
工业控制:在工业自动化和供电系统中作为信号调节器,确保控制单元获得稳定电压,提高可靠性。
通信设备:如路由器和无线设备等,LD1117 可用于降低电源噪音,提升信号质量。
嵌入式系统:在嵌入式设计中,其高效能与小型封装使其成为理想选择。
在电路设计中,需要注意以下几点以充分利用 LD1117AG-33-AB3-C-R 的优势:
输入电源能力:确保输入电源能够提供足够的电流并满足低压差要求,以避免在高负载下造成输出电压下降。
输出电容选择:为稳定输出电压,设计中应合理选择输出电容,通常推荐使用 10µF 的铝电解电容,必要时可以并联使用陶瓷电容以降低高频噪声。
功耗管理:根据应用的不同,评估系统中的热量产生情况,必要时增加散热措施,如散热片或风扇以提高稳定性。
PCB 布局:尽量将 LD1117 的输入、输出电容放置在芯片附近,减少电源轨的电感以及在高频运行下对电源稳定性的影响。
LD1117AG-33-AB3-C-R 是一个高效、可靠的线性稳压器,其固定 3.3V 输出与优异的电气特性使其成为许多中小型电子设备的理想选择。在设计中,只需关注输入条件、热管理和电路布局,即可实现高效、稳定的电源供应。无论是在消费电子、工业应用,还是嵌入式系统中,LD1117 都展现出其强大的适应性与广泛的应用前景。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products