WMSIC Electronic Components

Vishay CRCW04025K10FKED Resistor CRCW04025K10FKED

ModelCRCW04025K10FKED
Package0402
BrandVISHAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
VISHAY CRCW04025K10FKED
Type
VISHAY
Unit
Electronic Component
Minimum package
10000 卷

Technical parameters

Power
63mW
Electronic Component
Electronic Component
Electronic Component
VISHAY
Electronic Component
CRCW04025K10FKED
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.012g
Electronic Component
5.1kΩ
Electronic Component
1
Electronic Component
BM0230858966
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CRCW04025K10FKED 产品概述

一、主要参数与性能

CRCW04025K10FKED 为 VISHAY(威世)生产的厚膜贴片电阻,规格特点明确:标称阻值 5.1 kΩ(5K10),精度 ±1%,额定功率 1/16W(约 63 mW),额定工作电压 50 V,温度系数(TCR)±100 ppm/℃,工作温度范围 -55 ℃ 至 +155 ℃,封装尺寸 0402。厚膜工艺在小尺寸与成本之间提供了较好的折衷,适用于空间受限且对精度、温漂有中等要求的电子产品。

二、结构与封装

0402(公制 1005)封装为超小型表面贴装,适用于高密度 PCB 布局。厚膜电阻采用陶瓷基板与印刷电阻膜烧结而成,端接电极通过金属化处理,常以卷带(tape and reel)形式供应,便于自动贴装。物理尺寸小但热容量受限,散热能力主要依赖于焊盘与 PCB 铜量。

三、典型应用场景

  • 便携式电子设备、手机与穿戴设备中的分压、偏置与信号阻抗设置。
  • 工业控制与仪表中对体积与成本敏感的电阻网络。
  • 汽车电子内的非关键参考与滤波电路(需注意环境温度与可靠性要求)。
    该型号在对精度要求 1% 且功率需求较低的场合表现良好。

四、设计与选型建议

  • 功率与电压限制:名义功率 63 mW 为器件在规定环境下的最大耗散能力,按 P = V^2/R 可计算在该阻值下的最大允许电压约为 17.9 V(sqrt(0.063×5100) ≈ 17.9 V)。虽然器件标称工作电压为 50 V,但在实际电路设计中仍应保证不会因功率耗散而过热。
  • 温度漂移:TCR ±100 ppm/℃ 意味着每升高 100 ℃,阻值变化约 1.0% 左右,长期精度受温度循环影响,需要在高精度场合考虑配对或采用更低 TCR 的薄膜电阻。
  • PCB 设计:提升焊盘铜面积或采用散热过孔可改善散热,从而提高可用功率;但过大铜量在回流焊时可能引起焊接应力差异,应与工艺工程师协同优化。
  • 环境与可靠性需求高时,考虑使用更高功率或高稳定性电阻型号。

五、焊接与可靠性注意事项

推荐采用潮湿控制与标准回流焊工艺进行贴片安装,遵循 VISHAY 的焊接曲线规范。0402 封装对机械应力较敏感,避免在板上进行强力弯曲或机械碰撞。器件工作温度范围宽(-55 ~ +155 ℃),适应多数商用与工业环境;长期漂移与寿命受焊接温度、循环热应力与工作偏置影响,常规应用下可靠性良好。

六、采购与替代方案

该型号为 VISHAY CRCW0402 系列的常见规格,通常以卷带供应,适配自动化贴装。若需更低温漂或更高功率,可考虑同尺寸的薄膜或更大封装(0603、0805)型号;若需更高电压容限或更严格的寿命验证,则应选择专用功率或高稳定性系列。在计划替代时,确保新型号的 TCR、额定功率、最大工作电压与温度范围满足系统要求。

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