Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Vishay BAV303-TR Diode BAV303
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- VISHAY BAV303-TR
- Type
- VISHAY
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- BAV303-TR
- Electronic Component
- 1
- Package
- MicroMELF
- Electronic Component
- Switch Diode
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Electronic Component
- BM69419211
- Current
- 250mA
- Diode
- 1
- Current(Ir)
- 100nA@200V
- (Vf)
- 1V@100mA
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV303-TR 产品概述
产品简介 BAV303-TR 是由著名的电子元器件制造商 VISHAY（威世）所生产的一种高性能开关二极管，具有快速恢复特性和较高的反向电压能力，广泛应用于高频开关电路和整流电路中。它以 MicroMELF 封装形式提供，适用于表面贴装（SMD）应用，能够满足现代电子设备对小型化和高效率的要求。
关键参数
正向电压 (Vf): 在 100 mA 电流下，BAV303-TR 的正向电压为 1V，表明其在正常工作状态下的功耗较低，这对于降低整机功耗至关重要。
平均整流电流 (Io): 该二极管的DC平均整流电流可达到 250 mA，能够满足大多数低功耗应用的需求，比如小型电源和信号整流。
最大反向电压 (Vr): BAV303-TR 的最大反向电压为 200V，适用于需要较高电压隔离的应用场合，如汽车电子和工业设备。
反向泄漏电流: 在 200V 反向电压下，反向泄漏电流为 100 nA，极大地降低了在待机模式下的功耗，提升了设备的整体能效。
反向恢复时间 (trr): BAV303-TR 的反向恢复时间为 50 ns，确保能快速切换，适应高频操作的要求，降低了在开关过程中产生的功率损耗。
工作温度范围: 该产品的结温工作温度达到了 175°C（最大），适用于苛刻的环境条件，特别是在高温应用中表现优异。
应用领域 BAV303-TR 的设计使其适用于多种应用，主要包括：
- 开关电源: 由于其快速恢复特性，该二极管非常适合在开关电源中作为整流和保护元件，能够有效地提高电源的效率和稳定性。
- 高频信号电路: BAV303-TR 的低电容特性（1.5 pF @ 0V, 1MHz）使其适合于高频信号的开关，能够在信号传输过程中保证较低的失真和噪声。
- 汽车电子: 在汽车电气系统中，BAV303-TR 的高反向电压和耐高温特性使其能够被广泛应用于整流和保护电路。
- 工业控制系统: 在工业环境中，稳定的性能和长寿命使得 BAV303-TR 成为理想的选择，可以用于各种控制信号和替代传统的机械继电器。
封装与安装 BAV303-TR 采用 MicroMELF 封装，体积小巧，方便在空间受限的应用中使用。该样品采用表面贴装技术（SMD），可与现代化自动化生产线兼容，提高生产效率并缩短装配时间。
总结 综上所述，BAV303-TR 作为一种高性能的开关二极管，以其快速恢复、低反向泄漏电流以及高工作温度等特性，成为众多电子应用中的理想选择。不论是在高频开关电源、汽车电子还是工业控制系统中，BAV303-TR 都能为设计师提供出色的性能与可靠性，助力现代电子产品的发展。威世品牌在电子元器件领域的声誉和技术优势，更是为该产品的质量和性能提供了保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
