Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Vishay CRCW0402180RFKED Resistor CRCW0402180RFKED
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- VISHAY CRCW0402180RFKED
- Type
- VISHAY
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- CRCW0402180RFKED
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 180Ω
- Electronic Component
- 1
- Electronic Component
- BM0228536262
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CRCW0402180RFKED 产品概述
一、概述
CRCW0402180RFKED 是 VISHAY（威世）出品的一款 0402 封装厚膜贴片电阻，标称阻值 180 Ω，精度 ±1%，额定功率 62.5 mW，温度系数（TCR）±100 ppm/℃，工作温度范围 -55 ℃ 至 +155 ℃。该器件针对高密度表贴电路设计，体积小、性能稳定，适合对体积和成本有严格要求的消费电子与工业设备中的信号回路及分压/偏置应用。
二、主要参数与注意事项
- 阻值：180 Ω（标称）
- 精度：±1%（F级）
- 额定功率：62.5 mW（室温下）
- 允许工作电压：标称 50 V（器件绝缘/击穿限制），但实际受功率限制
- 基于功率的最大连续电流：I_max = √(P/R) ≈ √(0.0625/180) ≈ 0.0186 A（约 18.6 mA）
- 基于功率的最大电压：V_max_by_power = √(P·R) ≈ 3.35 V（约 3.35 V） 说明：尽管物理耐压可达 50 V，但在不超过热耗散能力的前提下，电路中施加的电压不得超过基于功率限制计算出的数值，否则会造成过热或失效。
三、热性能与可靠性
该厚膜电阻在 -55 ℃ 至 +155 ℃ 的工业级温度范围内工作，TCR ±100 ppm/℃（即约 0.01%/℃），说明随温度变化阻值漂移较小，适合对温漂有一定要求的应用。由于封装为 0402，热容量小，建议在设计时考虑热去耦与合理的功率余量（常见做法为在额定功率下按 50%~70% 退让使用），以提高长期可靠性和载流能力。
四、封装与焊接建议
- 封装：0402（厚膜芯片）
- 兼容无铅回流焊流程，符合现代表面贴装工艺（建议遵循器件厂商和 IPC/JEDEC 推荐的回流曲线）。
- 安装提示：为避免机械应力，PCB焊盘应按厂商推荐布局设计，避免过大的焊盘与器件热膨胀差异；贴装时注意湿度敏感等级和回流次数限制。
五、典型应用
- 精密分压、基准偏置与滤波网络
- 移动设备与便携产品的信号链路
- 仪表、传感器接口与低功耗模拟电路
- 高密度 PCB 的通用限流与阻抗匹配
六、合规与选型建议
该系列产品通常符合 RoHS/无铅要求，具体合规证书和可靠性测试数据请以 VISHAY 官方资料与器件数据表为准。选型时注意区分“额定工作电压（耐压）”与“基于功率的允许电压”，并在 PCB 设计与热管理上预留足够裕量，保证长期稳定工作。若电路中电压或功率接近上述极限，建议选择更大封装或更高功率等级的电阻以提高可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
