WMSIC Electronic Components

Vishay MMB02070C4700FB200 Resistor MMB02070C4700FB200

ModelMMB02070C4700FB200
PackageMELF-0207
BrandVISHAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VISHAY MMB02070C4700FB200
Type
VISHAY
Minimum package
2000 卷

Technical parameters

Power
1W
Electronic Component
VISHAY
Electronic Component
MMB02070C4700FB200
Electronic Component
1
Package
MELF-0207
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.12g
Electronic Component
470Ω
Electronic Component
1
Electronic Component
BM0230110116
Operating Temperature
55℃~+155℃
Operating Voltage
350V
Electronic Component
±50ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMB02070C4700FB200 产品概述

一、主要参数与标称

MMB02070C4700FB200 为 VISHAY(威世)推出的薄膜电阻,封装为 MELF-0207(亦标注 2309),标称阻值 470Ω,阻值精度 ±1%,温度系数(TCR)±50ppm/℃。额定工作电压可达 350V,适用工作温度范围 −55℃ 至 +155℃。用户提供资料中列示额定功率为 1W,另有描述显示 0.4W;在最终选型与可靠性评估时建议以厂家最新数据手册为准。

二、结构与封装

该款为薄膜(thin film)工艺制成的 MELF 圆柱形贴片电阻,具有良好的尺寸稳定性与阻值稳定性。MELF 翻边封装在高温回流与冲击振动条件下展现出优异的机械可靠性,配合卷带(T/R)包装方便自动贴装生产线应用。

三、关键特性与优势

  • 高精度:±1% 阻值公差,适合要求严格的阻抗匹配与分压电路。
  • 低温漂:±50ppm/℃ 的温度系数,保证随温度变化的阻值稳定性。
  • 宽温度范围与耐热性:−55℃~+155℃,适用严苛环境。
  • 耐硫化性:针对含硫环境进行了防护处理,适合油气、工业与汽车等恶劣场景。
  • 汽车级认证:满足 AEC‑Q200 要求,符合车规级可靠性标准。

四、典型应用场景

适用于汽车电子(传感器、控制单元)、精密测量与采样电路、滤波/分压网络、信号调理及工业控制设备等需要高稳定性与高可靠性的场合。对硫化敏感环境与车规级产品尤为合适。

五、选型要点与安装建议

  • 确认功率与散热条件:MELF 包装的散热特性与 PCB 板上铜箔面积、环境散热密切相关,建议遵循厂家功率-温度特性曲线并适当降额使用。
  • 焊接工艺:可采用标准无铅回流工艺,注意避免过度机械应力(抓手夹具或回流后过度弯折可能导致失效)。
  • 验证数据:针对用户资料中功率标注不一致(1W 与 0.4W),在设计前请以 VISHAY 官方数据手册为准,确认最大允许功耗与评估热阻。
  • 并联/串联使用:用于更高功耗或更精确阻值时,可考虑电阻并联/串联,并注意匹配阻值与功率分配。

六、品质与可靠性

VISHAY 品牌与 AEC‑Q200 认证为本型号提供了良好的可靠性基础,薄膜工艺带来长期阻值稳定与低噪声特性。对于车辆与工业级长期运行环境,配合正确的热管理与焊接流程,可获得优异的寿命与一致性。

若需更详细的尺寸图、功率—温度曲线、焊接曲线和寿命测试数据,请联系供应商或参考 VISHAY 官方数据手册以完成最终设计验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.