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Vishay BAT54-02V-G3-08 Diode BAT54
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY BAT54-02V-G3-08
- Type
- VISHAY
- Minimum package
- 8000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- BAT54-02V-G3-08
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.15g
- Electronic Component
- 1
- Electronic Component
- BM0228533077
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 800mV@100mA
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54-02V-G3-08 产品概述
一、概述
BAT54-02V-G3-08 为 VISHAY（威世）推出的一款肖特基势垒二极管，采用 SOD-523 超小封装，针对空间受限、对正向压降和反向漏流有较高要求的便携与低电压应用。器件为独立式二极管配置，工作结温范围宽，适合一般商业与工业温度环境使用。
二、主要电气参数
- 正向压降 (Vf)：800 mV @ 100 mA
- 整流电流 (If)：200 mA（持续正向电流）
- 非重复峰值浪涌电流 (Ifsm)：600 mA
- 直流反向耐压 (Vr)：30 V
- 反向电流 (Ir)：2 μA @ 25 V
- 工作结温范围：-55 ℃ ~ +125 ℃
三、封装与可靠性
- 封装：SOD-523，体积小、占板面积低，适合高密度贴装
- 品牌/合规：VISHAY（威世），G3 后缀表明符合无铅/环保焊接工艺（RoHS）要求
- 热性能：受限于小尺寸封装，长期高电流工作需考虑结温上升与散热路径设计
四、典型应用场景
- 低压快恢复整流与电源反向保护（便携设备、移动电源）
- 逻辑电平保护、接口保护与电平移位电路（TTL/CMOS 输入保护）
- 小信号整流、开关电源二次整流与保护二极管
- 需要低正向压降且反向漏流受控的低功耗电路
五、设计与使用建议
- 在接近额定整流电流工作时，应评估封装热阻并在 PCB 设计中增加散热通道或铜箔面积；峰值浪涌（Ifsm）仅短时允许。
- 对于高反向电压或高温环境，需关注 Ir 随温度上升的增长，必要时选用更高 Vr 或更低 Ir 的器件。
- 若电路对压降敏感，应验证 800 mV@100 mA 在实际工况下的表现，低电流时 Vf 会更低。
六、结论
BAT54-02V-G3-08 以其小尺寸封装与适度的电气特性，适合需节省 PCB 面积且要求低正向压降与低反向漏流的多种便携与接口保护应用。在设计时注意热管理与浪涌电流限制，可获得稳定可靠的性能。若需更高电流或更低漏电的方案，可基于具体应用进一步选型或级联使用。
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