Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Vishay BAS70-02V-G3-08 Diode BAS70
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY BAS70-02V-G3-08
- Type
- VISHAY
- Minimum package
- 8000 卷
Technical parameters
- Electronic Component
- VISHAY
- Electronic Component
- BAS70-02V-G3-08
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.004g
- Electronic Component
- 1
- Electronic Component
- BM0003120471
- Current
- 100mA
- Diode
- 1
- Current(Ir)
- 100nA@50V
- (Vf)
- 1V@15mA
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
- Voltage Rating(Vr)
- 70V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS70-02V-G3-08 产品概述
1. 产品介绍
BAS70-02V-G3-08是一款由Vishay（威世）公司生产的肖特基二极管，采用SOD-523封装，专为高频应用和低功耗电路而设计。该二极管以其优良的性能，特别是在高速开关、整流和信号处理领域中得到了广泛应用。其主要特点包括低正向电压降、快速恢复时间和出色的温度稳定性，使其成为诸如便携式电子设备、射频应用和电源管理电路等领域的理想选择。
2. 主要参数
- 正向电压（V_f）: 在15mA的电流下，正向电压降为约1V。这一特性使得其在降低电能损耗和提高电路效率方面表现突出。
- 反向耐压（V_R）: 最高可承受70V的反向电压，能够适应多种工作条件，确保器件在反向偏置时不会发生击穿。
- 反向漏电流（I_R）: 反向漏电流在50V下仅为100nA，显示出出色的隔离性，有效降低了电路的功耗。
- 最大正向电流（I_f）: 二极管在额定条件下的最大正向电流为200mA，能够满足大部分基于肖特基二极管的应用需求。
3. 封装和尺寸
BAS70-02V-G3-08采用SOD-523封装，具有小巧轻便的特点，适合现代小型化电子产品的设计需求。此封装的热性能优良，能够有效散热，确保器件在高温环境下的可靠性和使用寿命。此外，SOD-523封装使得PCB设计更为灵活，为设计师提供了更多的布局选择。
4. 应用领域
BAS70-02V-G3-08广泛应用于以下领域：
- 便携式电子设备: 例如智能手机、平板电脑和穿戴设备中，该二极管可用于电源管理和信号整流。
- 射频电路: 在高频率信号传输中，肖特基二极管能够快速处理信号，并减少延迟，提升整体性能。
- 电池充电电路: 由于其低正向电压降和高反向耐压，适合用于高效电池充电和保护电路。
- 开关电源: 在开关电源设计中，BAS70-02V-G3-08可以作为整流器使用，大幅提高电源转换效率。
- 负载开关: 在负载开关电路中，作为保护器件使用，防止反向电流对电子组件造成损害。
5. 性能优势
BAS70-02V-G3-08的设计充分考虑了低功耗和高性能的需求。其肖特基特性使得该二极管在大多数应用中具有更低的电压降，相较于传统硅二极管，更为高效。此外，快速的恢复时间确保了在高频应用中，信号的完整性和质量，避免不必要的信号失真和延迟。
6. 结论
作为一款高效能的小型肖特基二极管，BAS70-02V-G3-08凭借其卓越的电气特性和广泛的应用潜力，正在推动现代电子产品的创新设计。无论是在便携式设备、射频应用还是电源管理领域，该二极管都能提供可靠的性能，助力设计师在保证效率的同时缩小产品体积。Vishay的BAS70-02V-G3-08二极管无疑是当今电子市场上值得推荐的优质选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
