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Vishay CRCW0402499RFKED Resistor CRCW0402499RFKED
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- VISHAY CRCW0402499RFKED
- Type
- VISHAY
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- CRCW0402499RFKED
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.012g
- Electronic Component
- 499Ω
- Electronic Component
- 1
- Electronic Component
- BM0246759564
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CRCW0402499RFKED 厚膜贴片电阻产品概述
一、产品基本定位
CRCW0402499RFKED是VISHAY（威世） 推出的一款0402封装厚膜贴片电阻，属于CRCW系列标准型厚膜电阻范畴。该产品以「小体积、稳定性能、成本可控」为核心特点，适配中低功率、中等精度需求的电子电路设计，广泛覆盖消费电子、工业控制等领域的批量应用场景。
二、核心性能参数详解
该电阻的关键参数明确了其应用边界与性能表现，具体如下：
- 阻值与精度：标称阻值499Ω，精度±1%——满足大多数非超高精度电路的信号调节、分压需求，无需额外高精度电阻的成本投入；
- 功率与电压：额定功率62.5mW，最大工作电压50V——适配低功率信号处理、小型传感器前端等低功耗场景，避免功率过载风险；
- 温度特性：温度系数±100ppm/℃，工作温度范围-55℃~+155℃——在宽温度环境下阻值漂移较小（如温度变化210℃时，阻值变化约10.5Ω），可稳定工作于极端高低温场景（如车载低温启动、工业高温车间）；
- 工艺类型：厚膜工艺——平衡了成本与性能，相比薄膜电阻成本更低，相比碳膜电阻稳定性更强，适合批量生产。
三、封装与物理特性
- 封装尺寸：采用0402封装（公制1005，即1.0mm×0.5mm），是贴片电阻中体积较小的封装之一，适配高密度PCB设计（如智能手机主板、小型穿戴设备）；
- 贴装适配性：符合SMT自动化贴装标准，可通过常规贴片设备实现高速批量生产，降低人工成本；
- 焊接可靠性：端电极采用适合回流焊、波峰焊的设计，焊接后附着力强，长期使用不易出现虚焊、脱落问题。
四、典型应用场景
结合参数与封装特点，该电阻主要适用于以下场景：
- 消费电子：智能手机、平板电脑、智能手表等小型设备的信号滤波、分压电路（如音频模块、传感器接口）；
- 工业控制：小型PLC、传感器节点的低功率信号处理电路（如温度传感器信号调理、模拟量输入分压）；
- 汽车电子：车载小型模块（如后视镜控制、车内氛围灯驱动）的辅助电路（需确认产品是否通过汽车级认证，若符合则适配）；
- 通信设备：小型路由器、WiFi模块的射频周边电路（如低功率匹配网络、滤波电路）。
五、产品优势总结
- 品牌可靠性：VISHAY作为全球知名电子元器件厂商，产品经过严格可靠性测试（如高温老化、湿度循环），长期使用故障率低；
- 成本与性能平衡：厚膜工艺+0402封装，在满足基本性能的前提下，控制了单颗成本，适合中小批量至大规模采购；
- 宽温适应性：-55℃~+155℃的工作温度范围，覆盖了大多数工业与车载场景的温度需求，无需额外温度补偿；
- 小体积高密度：0402封装适配现代电子设备的小型化、轻薄化设计趋势，可有效提升PCB布局密度，减少设备体积。
该产品凭借稳定的性能与适配性，成为消费电子、工业控制等领域中小功率电路的常用选型之一。
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