WMSIC Electronic Components

Vishay CRCW08052K20JNEA Resistor CRCW08052K20JNEA

ModelCRCW08052K20JNEA
Package0805
BrandVISHAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
VISHAY CRCW08052K20JNEA
Type
VISHAY
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
VISHAY
Electronic Component
CRCW08052K20JNEA
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.028g
Electronic Component
2.2kΩ
Electronic Component
1
Electronic Component
BM0227223802
Operating Temperature
55℃~+155℃
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CRCW08052K20JNEA 产品概述

一、主要规格

CRCW08052K20JNEA 为 VISHAY(威世)生产的厚膜贴片电阻,关键参数如下:

  • 电阻值:2.2 kΩ
  • 精度:±5%(J)
  • 功率:125 mW(1/8 W 额定)
  • 温度系数(TCR):±200 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:0805(常见尺寸约 2.0 mm × 1.25 mm)
  • 电阻类型:厚膜(Thick Film)

二、产品特点

  • 稳定性好:厚膜工艺结合严格的工艺控制,使得在一般环境下具有良好的长期稳定性和可重复性。
  • 宽温度范围:-55 ℃ 到 +155 ℃ 的耐受能力,使其适用于高温或工业级环境。
  • 通用规格:2.2 kΩ/±5% 为常用阻值与精度,适配多数分压、限流与偏置网络。
  • 封装小巧:0805 封装便于高密度 PCB 布局,适合自动贴装与回流焊工艺。

三、典型应用场景

  • 工业控制与传感器接口电路(限流、分压、阻抗匹配)
  • 通用电子设备的偏置和滤波网络
  • 通信设备与仪表仪器中要求中等精度与可靠性的场合
  • 要求小封装与中等功率的消费电子与嵌入式系统

四、选型要点与使用注意

  • 温度降额:额定功率 125 mW 通常在指定环境温度下测得;在高温工作条件下需按厂商的功率温度降额曲线进行降额使用。
  • 精度与漂移:±5% 精度适合一般用途,若用于精密测量或高精度配对应选择更高精度(≤1%)或配套温度补偿方案。
  • 温度系数:±200 ppm/℃ 表示中等温漂,温度敏感电路应考虑温漂影响并作补偿或选择低 TCR 型号。
  • 封装热特性:0805 小尺寸意味着热阻较大,布局上应预留散热路径,避免紧邻大功率器件造成过热。

五、焊接与可靠性建议

  • 采用标准回流焊工艺,遵循 VISHAY 推荐的回流温度曲线以保证焊接可靠性。
  • 避免在装配过程中施加过大的机械应力(弯折、挤压),以防引起端接开裂或电阻值漂移。
  • 在潮湿或腐蚀性环境中建议采取防护涂层或选用具有相应认证的表面处理/封装形式。

六、包装与采购提示

  • CRCW 系列通常以卷带(Tape & Reel)方式提供,适用于自动贴片生产线。
  • 订购时请核对完整料号与包装代码,确认是否需要 RoHS/无铅或特殊认证版本。
  • 如需在极端环境或关键应用中使用,建议向供应商索取详细规格书与可靠性试验数据以做最终确认。

若需我进一步提供该料号的完整规格书关键页、封装图或温度功率降额曲线,可告知,我将为您检索并整理。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.