Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
VISHAY TZMB5V1-GS08 TZMB5V1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY TZMB5V1-GS08
- Type
- VISHAY
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- TZMB5V1-GS08
- Electronic Component
- 1
- Package
- MiniMELF(SOD-80)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.052g
- Electronic Component
- 1
- (Zzk)
- 550Ω
- (Zzt)
- 60Ω
- Electronic Component
- BM0107671345
- Diode
- 1
- Current(Ir)
- 100nA
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 5V~5.2V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：TZMB5V1-GS08 稳压二极管
一、产品简介
TZMB5V1-GS08 是由VISHAY（威世）公司生产的一款稳压二极管，标称电压为5.1V，适配于需要稳压保护的各种电子电路。该器件以其优异的性能和广泛的应用范围，成为电子设计领域中不可或缺的元器件之一。
二、关键技术参数
电压特性
- 齐纳电压（Vz）：5.1V（标称值），允许的电压范围为5.0V至5.2V，具备良好的稳压能力。
- 反向泄漏电流（Ir）：在1V时，反向泄漏电流仅为100nA，这意味着在正常工作条件下，器件的能耗极低，有助于提高电路的整体能效。
功率与阻抗
- 最大功率：500mW，确保在高功率应用中依然能保持稳定的工作状态。
- 最大阻抗（Zzt）：60Ω，这一系列参数保证了在不同条件下的压降小，从而更好地满足设计需求。
导通电压特性
- 正向电压（Vf）：在200mA的条件下，正向电压为1.5V，有助于维持电路的低能耗特性。
温度范围
- 工作温度范围为-65°C至175°C，使其在极端环境条件下依然可以可靠运行，适用于航空、军工及高温环境中的应用。
三、封装类型与安装方式
TZMB5V1-GS08 采用SOD-80 MiniMELF封装，使用表面贴装技术（SMD），便于在现代电子设备中进行自动化生产。SOD-80的封装设计使得器件体积小、效率高，适合密集型线路板设计，尤其是在空间有限的情况下。
四、应用场景
TZMB5V1-GS08 稳压二极管广泛应用于以下领域：
- 电源管理：作为电源滤波器使用，保护后续电路免受高频噪声影响。
- 电路保护：在瞬态电压抑制装置中应用，防止电源浪涌对敏感组件造成损害。
- 信号稳压：在信号处理设备中，为模拟信号提供稳定的基准电压。
- 工业控制：适用于各种机械设备和自动化系统，提供必要的电压稳定性保障。
五、总结
TZMB5V1-GS08 稳压二极管凭借其低泄漏、宽工作温度范围、高功率处理能力和紧凑的封装设计，成为现代电子设计中的重要一员。无论是在电源管理、信号处理还是电路保护等领域，TZMB5V1-GS08 都能够提供可靠的性能支持。作为VISHAY（威世）品牌的一部分，该器件的可靠性和性能得到了业界广泛认可，适合各种严苛应用场景。选择TZMB5V1-GS08，将为您的电子设计增添更高的稳定性与安全性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
