WMSIC Electronic Components

VISHAY SI2302CDS-T1-GE3 SI2302CDS

ModelSI2302CDS-T1-GE3
PackageSOT-23-3(TO-236)
BrandVISHAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
VISHAY SI2302CDS-T1-GE3
Type
VISHAY
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
VISHAY
Electronic Component
SI2302CDS-T1-GE3
Electronic Component
1
Package
SOT-23-3(TO-236)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0000288263
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
550mW
Gate Voltage(Vgs)
±8V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2302CDS-T1-GE3 产品概述

概述

SI2302CDS-T1-GE3 是由 VISHAY(威世)公司推出的一款高性能 N 沟道金属氧化物半导体场效应管(MOSFET),广泛应用于各类电子设备中。该器件特别适合需要较高电流和低导通电阻的场合,能够提供优异的开关性能和热性能,且在小型封装中具备优秀的功率处理能力。

产品特点

  1. 漏源电压(Vdss): SI2302CDS-T1-GE3 的最大漏源电压为 20V,适用于低电压的功率管理和开关电源设计。

  2. 连续漏极电流(Id): 在 25°C 环境下,该 MOSFET 的连续漏极电流为 2.9A,这使其在实际应用中能够承载相对较大的电流,适合电池管理、无刷电机驱动和开关电源等应用。

  3. 导通电阻(Rds(on)): 在 4.5V 的栅源电压下,SI2302CDS-T1-GE3 的导通电阻为 57mΩ @ 3.6A。这一特性确保了器件在通电时的功率损耗极小,提高了电路的能效,非常适合用于高频开关电源及电源管理任务。

  4. 栅源极阈值电压(Vgs(th)): 本器件的阈值电压为 850mV,能够在较低的驱动电压下有效开启。这使得其在低电压应用中表现出色,有助于减少驱动电路的功耗。

  5. 低栅极电荷(Qg): 栅极电荷最大值为 5.5nC @ 4.5V,表明其驱动效率较高,适合快速开关应用,能够显著提高设计的快速响应能力。

  6. 封装类型: SI2302CDS-T1-GE3 采用了小型 SOT-23-3(TO-236)表面贴装封装,该封装形式减小了电路板的空间占用,使得该器件容易集成进更紧凑的电子设备中,从而满足现代电子产品对空间和重量的要求。

  7. 工作温度: 该器件的工作温度范围广泛,从 -55°C 到 150°C,十分适合于极端环境或高温应用条件下的操作,例如汽车电子以及工业控制等领域。

  8. 功率耗散: 在环境温度 25°C 下,其最大功率耗散为 710mW,能够处理相当可观的功率,适合多种高密度电路设计需求。

应用场景

SI2302CDS-T1-GE3 MOSFET 适用于多种应用场合,如:

  • 电源管理: 在开关电源、DC-DC 转换器等设备中用作开关元件,提升效率并减少损耗。

  • 电池保护: 在电池管理系统中用于过电流保护、过充电保护等关键安全功能。

  • 无刷电机驱动: 作为电机控制电路中的开关元件,提高应用的响应速度和控制精度。

  • 汽车电子: 其广泛的工作温度范围和高耐压特性,使其成为汽车应用中的可靠选择。

  • 家用电器: 在电机驱动和功率转换电路中日益普遍的使用。

总结

SI2302CDS-T1-GE3 为设计师提供了一种高效能的 N 沟道 MOSFET 解决方案,支持多种高性能应用。凭借其出色的导通电阻、低驱动电压和优越的散热性能,适合要求高可靠性和高效率的电子产品设计。VISHAY 的这一产品,为电源管理和控制电路提供了强有力的支持,是现代电子设计中不可或缺的重要元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.