Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
VISHAY S2M-E3/52T S2M-E3
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY S2M-E3 / 52T
- Type
- VISHAY
- Minimum package
- 750 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- S2M-E3/52T
- Electronic Component
- 1
- Package
- DO-214AA
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.216g
- Electronic Component
- 1
- Electronic Component
- BM0258624612
- Current
- 1.5A
- Diode
- 1
- Current(Ir)
- 1uA@1kV
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 750
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S2M-E3/52T 产品概述
简介
S2M-E3/52T 是一款高性能的标准二极管，广泛应用于电力电子、开关电源、充电器以及汽车电子等领域。其具有高额定反向电压 (Vr 最大值为 1000V) 和较高的平均整流电流 (Io 高达 1.5A)，使其能够在多种严苛的工作条件下稳定运作。
主要参数
反向电压 (Vr)：该二极管的最大反向电压为 1000V，能够有效抵御反向电压的瞬变，为电路提供更高的安全性和可靠性。
整流电流 (Io)：S2M-E3/52T 在 1.5A 的平均整流电流条件下，能够维持稳定的性能，提高了电源转换效率，有利于在各种电源设计中使用。
正向电压 (Vf)：在 1.5A 电流下，该二极管的正向电压降为 1.15V，确保了电路中能量的最小损耗，从而提升了整体的效率。
反向恢复时间 (trr)：在高电流条件下，该二极管的反向恢复时间为 2µs，适合快速开关电路的应用，有效减少了开关损耗，提高了系统的响应速度。
反向泄漏电流：在最大反向电压 1000V 条件下，其反向泄漏电流低至 1µA，进一步提高了元件的稳定性和可靠性。
结温范围：该二极管的工作结温范围为 -55°C 至 150°C，特别适合于高温和低温下工作，展现出广泛的环境适应性。
电容特性：在 4V、1MHz 的条件下，二极管展示出 16pF 的电容值，适合用于高频电路应用。
封装与安装
S2M-E3/52T 采用表面贴装型封装 DO-214AA（SMB），具有小尺寸、低重量的优势，便于在紧凑的空间内进行高效的布局。表面贴装技术 (SMT) 的应用还提高了产品的生产效率和加工精度，适合现代电子设备的制造需求。
应用领域
由于其优异的电气性能和适应性，S2M-E3/52T 通常应用于以下领域：
- 开关电源：在转化电源电压时，该二极管能保证有效的整流，支持设备的高效运行。
- 整流电路：作为整流二极管，有助于将交流电转换为直流电，满足多种应用的需求。
- 电池充电器：在充电电路中，能提供高效的正向导通和低反向泄漏，确保充电效率和安全性。
- 汽车电子：稳定的工作温度范围和高反向电压能力，使其在汽车电子控制单元 (ECU) 等领域具有广泛的应用潜力。
结论
S2M-E3/52T 是一款具有卓越性能的通用二极管，适合作为各类高压、高效率应用中的关键组件。凭借其可靠的电气特性和优化的封装设计，该元件不仅能够满足现代电子产品对高性能和小型化的需求，也为设计工程师提供了灵活的设计空间和可靠的解决方案。无论是在工业、消费电子、还是汽车领域，其优越性都使其成为业界的首选器件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
