Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
VISHAY TNPW060349K9BEEA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY TNPW060349K9BEEA
- Type
- VISHAY
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- TNPW060349K9BEEA
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.022g
- Electronic Component
- 49.9kΩ
- Electronic Component
- 1
- Electronic Component
- BM0259383332
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TNPW060349K9BEEA 产品概述
一、产品简介
TNPW060349K9BEEA 为 VISHAY（威世）TNPW 系列薄膜平片电阻，封装为 0603（公制 1.6 mm × 0.8 mm），阻值 49.9 kΩ，精度 ±0.1%，额定功率 0.1 W（100 mW），温度系数（TCR）±25 ppm/℃，工作温度范围 -55 ℃ 至 +155 ℃。该器件采用薄膜工艺制造，适用于要求高精度、低噪声和优良长期稳定性的场合。
二、主要性能参数
- 阻值：49.9 kΩ
- 精度：±0.1%
- 额定功率：0.1 W（100 mW）
- 温度系数：±25 ppm/℃
- 工作温度：-55 ℃ ~ +155 ℃
- 封装：0603（1.6 × 0.8 mm）
- 结构：薄膜平片（低噪声、低电压系数、优良的长期漂移特性）
- 品牌：VISHAY（威世）
三、产品特性与优势
- 高精度：±0.1% 容差可显著降低电阻匹配误差，适合精密分压、比例放大等电路。
- 低 TCR：±25 ppm/℃ 保证温度变化下阻值稳定，适用于温度敏感的测量与补偿电路。
- 良好长期稳定性：薄膜工艺使器件具有优异的老化特性与漂移控制。
- 低噪声、低电压系数：提高信号完整性，适合低电平和高速信号通路。
- 小型化：0603 尺寸有利于高密度 PCB 布局与自动化贴装工艺。
四、典型应用
- 精密测量仪表、传感器前端放大器（例如电桥、应变片、热电偶补偿）
- 高精度模拟滤波器与电子校准电路
- 精密参考电路、ADC 前端、电位器替代与分压网络
- 航空航天、工业控制、医疗设备等对可靠性要求高的场合
五、封装与装配建议
- 封装兼容标准无铅回流焊工艺，建议遵循 VISHAY 的回流温度和时间规范（通常兼容最高峰值回流温度 260 ℃ 的有限时间露点）。
- 在 PCB 设计中采用与 0603 对应的焊盘尺寸，保证良好焊接湿润与热传导。
- 在高温环境下应按厂商提供的温度降额曲线进行功率管理，避免长期在额定功率极限附近运行以延长寿命。
六、可靠性与使用注意事项
- 建议在设计时预留适当的功率裕度并关注环境温度对功率能力的影响；高温时需进行功率降额。
- 避免在焊接或后处理过程中对器件施加过大的机械应力（弯曲、挤压），以防引起应力漂移或终端断裂。
- 保存与清洗：通常兼容常规清洗流程，具体请参照 VISHAY 的清洗与储存建议。
- 如需更详细的电气特性、寿命试验与热降额曲线，请参考 VISHAY 官方 Datasheet 或联系授权经销商获取技术支持。
总结：TNPW060349K9BEEA 以其高精度、低 TCR 与薄膜制造工艺，在需要高稳定性与低噪声的精密电子设计中具有明显优势，是精密测量与高可靠性应用的优选元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
