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VISHAY MMB02070C1008FB200
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY MMB02070C1008FB200
- Type
- VISHAY
- Minimum package
- 2000 圆盘
Technical parameters
- Power
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- MMB02070C1008FB200
- Electronic Component
- 1
- Package
- MELF-0207
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.11g
- Electronic Component
- 1Ω
- Electronic Component
- 1
- Electronic Component
- BM0246758885
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 350V
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMB02070C1008FB200 产品概述
一、产品简介
MMB02070C1008FB200 为 VISHAY（威世）出品的薄膜 MELF 电阻，封装为 MELF-0207（亦标注为 0207/2309）。标称阻值 1 Ω，阻值公差 ±1%，温度系数（TCR）典型值 ±50 ppm/°C，额定工作温度范围 -55 ℃ 至 +155 ℃。该型号针对工业与汽车级应用设计，符合 AEC‑Q200 要求，并具备抗硫化（Sulfur Resistant）特性，适合在含硫或腐蚀性气氛下长期使用。
二、主要技术参数
- 阻值：1 Ω
- 精度：±1%
- 温度系数：±50 ppm/°C
- 工作温度：-55 ℃ ~ +155 ℃
- 封装：MELF‑0207（圆柱形 SMD）
- 环境/可靠性：汽车级 AEC‑Q200、抗硫化处理
（说明：样品资料中同时出现 0.4 W 与 1 W 的功率标称，请以厂商最终规格书为准，并参考器件的功率耗散与 PCB 散热条件进行降额设计。）
三、结构与封装特点
MELF‑0207 圆柱形金属化陶瓷封装提供优良的热散及机械应力分布，薄膜电阻工艺保证低噪声、高稳定性及良好的脉冲承受能力。抗硫化涂层或材料选择可降低含硫环境导致接触或电阻变化的风险，延长器件寿命。
四、关键优势
- 精度高、TCR 低：±1% 与 ±50 ppm/°C 适合精密测量与补偿场合。
- 汽车级可靠性：符合 AEC‑Q200，适用于车载电子。
- 抗硫化：在恶劣大气或工业场景更可靠。
- MELF 封装：热性能与脉冲稳定性优于常规片式电阻，焊接可靠。
五、典型应用
- 电流取样/电流检测（低阻值电阻）
- 汽车电子与传感器前端电路
- 精密放大器的电阻网络与反馈回路
- 工业控制器及恶劣环境下的测量与保护电路
六、选型与使用建议
- 在实际电流/功率条件下，参考厂商的功率耗散与降额曲线，考虑 PCB 铜箔面积与散热路径。
- 焊接工艺需控制热剖度以避免热应力，MELF 封装对回流与波峰焊兼容，但建议参照 VISHAY 的焊接指南。
- 对于长期暴露在含硫环境的应用，可优先选择带抗硫化说明的型号并进行长期可靠性验证。
- 最终设计前请下载并核对官方数据手册，确认额定功率、脉冲能力与寿命测试数据。
七、结论
MMB02070C1008FB200 是一款为汽车与工业级精密应用优化的薄膜 MELF 电阻，结合高精度、低 TCR 与抗硫化特性，适合要求稳定性与可靠性的场景。选型时务必以 VISHAY 官方规格书为准，并根据实际热环境进行合理的功率降额与布线设计。
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