Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
VISHAY SMBJ3V3-E3/52 SMBJ3V3
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- VISHAY SMBJ3V3-E3 / 52
- Type
- VISHAY
- Unit
- Electronic Component
- Minimum package
- 750 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- SMBJ3V3-E3/52
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.217g
- Electronic Component
- 1
- Cj- Capacitor
- 5.2nF
- Electronic Component
- BM0000287336
- Voltage
- 10.3V
- Current(Ir)
- 200uA
- Voltage(VBR)
- 4.1V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SMBJ3V3-E3/52
1. 引言
SMBJ3V3-E3/52是VISHAY（威世）推出的一款高性能瞬态电压抑制二极管（TVS Diode），特别设计用于保护电子设备免受电压突波的影响。该产品在电子元器件中具有极高的可靠性和优异的性能，非常适合用于各种工业、汽车和消费电子应用。
2. 基础参数
SMBJ3V3-E3/52的主要电气特性包括：
- 夹位电压：10.3V，确保在电压出现过大时能够迅速反应与限制其值，以保护下游电路。
- 击穿电压（最小值）：4.1V，确保即使在高频工况下，产品仍能稳定工作。
- 反向关断电压（典型值）：3.3V，非常适合需要低电压保护的应用。
- 电流 - 峰值脉冲 (10/1000µs)：200A（8/20µs），说明能够承受瞬态过电流，对抗雷击及电荷瞬变的能力十分强大。
- 功率 - 峰值脉冲：600W，消耗该范围内的能量时依然能够确保器件安全运行。
3. 结构与封装
SMBJ3V3-E3/52采用表面贴装型封装，封装类型为DO-214AA（SMB），这一设计有助于在各种PCB设计中实现紧凑的布局，进一步提高散热效率。值得一提的是，表面贴装的设计使得该二极管能够灵活适应不同的生产工艺，尤其是在自动化贴装流程中表现尤为突出。
4. 电气性能与特性
这款TVS二极管的电气特性使其适合广泛的应用。在不同频率情况下，SMBJ3V3-E3/52能够提供5200pF的电容值（在1MHz下测量）。这种较低的电容值确保了在高频切换环境下的良好性能表现。此外，-65°C至175°C的工作温度范围使得该二极管可在极端环境中稳定工作。
5. 应用场景
SMBJ3V3-E3/52广泛应用于各种需要电源线、信号线保护的场景，包括但不限于：
- 智能手机和便携式设备：能够有效防止静电放电（ESD）和雷击造成的损害。
- 消费电子产品：如电脑、电视及其他家用电器，确保电路在瞬态电压干扰下的稳定性。
- 汽车电子：在汽车的传感器和控制模块中起到保护作用，防止高压突变影响系统正常工作。
- 工业设备：保护电机驱动电路和控制器免受电压尖峰的影响，延长设备使用寿命。
6. 结论
综上所述，VISHAY的SMBJ3V3-E3/52是一款具备优越性能的TVS二极管，凭借其出色的电气参数、宽广的工作温度范围和灵活的封装设计，使其能够在多种应用中提供有效的保护。无论在消费者电子、工业市场还是汽车领域，该产品均能有效抵御电压突波，从而保护关键信号线和电源线路的完整性，确保可靠性和长期稳定的工作性能。在选择电气保护方案时，SMBJ3V3-E3/52是一个非常值得考虑的优质选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
