WMSIC Electronic Components

VISHAY SI3421DV-T1-GE3 SI3421DV

ModelSI3421DV-T1-GE3
PackageTSOP-6
BrandVISHAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
VISHAY SI3421DV-T1-GE3
Type
VISHAY
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
VISHAY
Electronic Component
SI3421DV-T1-GE3
Electronic Component
1
Package
TSOP-6
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.07g
Electronic Component
1
Electronic Component
BM0004117805
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
4.2W
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI3421DV-T1-GE3 产品概述

1. 产品简介

SI3421DV-T1-GE3是一款高性能的P沟道MOSFET,具备优秀的电气参数和热性能,适用于各种电源管理和开关应用。该器件由业界知名的电子元器件制造商VISHAY(威世)提供,具有卓越的可靠性和稳定性,非常适合工业、消费电子和汽车等多种应用场景。

2. 基本规格

  • FET类型: P通道
  • 技术: MOSFET(金属氧化物场效应管)
  • 漏源电压(Vdss): 30V,适合中等电压电源应用
  • 电流: 25°C下连续漏极电流(Id)达到8A,支持高负载能力
  • 驱动电压: 最大Rds On为4.5V(推荐工作范围在10V内),确保良好的导通特性

3. 导通特性和电阻

该MOSFET的导通电阻在不同电流和栅极电压下呈现出优异的性能:

  • 最大导通电阻(Rds On): 在7A和10V时,Rds On最大为19.2毫欧,这样的低导通电阻有助于降低传输损耗,提高系统效率。
  • Vgs(th): 在250µA时,最大门阈电压(Vgs(th))为3V,提供了广泛的工作范围和灵活性。

4. 驱动和输入特性

  • 栅极电荷 (Qg): 在10V的栅源电压下,栅极电荷达到最大值为69nC,能快速响应栅极驱动,提升开关效率。
  • 输入电容 (Ciss): 最大输入电容为2580pF,适合以较高频率进行开关操作。

5. 功率耗散和温度范围

  • 功率耗散: 在环境温度(Ta)下能够承受最大功率为2W,而在结温(Tc)条件下可以达到4.2W,适合于高效能的应用需求。
  • 工作温度范围: 该器件具有广泛的工作温度范围,从-55°C到150°C,适合于高温或极端冷却的环境中使用。

6. 封装与安装

  • 封装: SI3421DV-T1-GE3采用6-TSOP封装(SOT-23-6),其细型设计适合于表面贴装(SMD)技术,有助于节省空间,提高组件密度。
  • 安装类型: 表面贴装型设计使得该器件可以轻松集成到各类现代电路板中。

7. 应用领域

SI3421DV-T1-GE3的设计使其在多种应用中表现优异,包括但不限于:

  • 电源管理模块: 高效的DC-DC转换器和电源轨控制,以提高系统的整体效率。
  • 汽车电子: 在汽车电气系统中如电动窗、车灯控制等,提供可靠的开关控制。
  • 工业控制: 自动化设备和电机驱动电路中的开关应用,确保高效和可靠的操作。

8. 结论

SI3421DV-T1-GE3是一款功能强大、性能可靠的P沟道MOSFET,凭借其低导通电阻、高连续电流及宽广的工作温度范围,使其适合用于多种要求严苛的电子应用中。VISHAY(威世)的这一产品将为设计工程师提供灵活性、效率和可靠性的高效解决方案,是推动现代电子技术发展的重要助力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.