Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
VISHAY MMA02040C1653FB300
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY MMA02040C1653FB300
- Type
- VISHAY
- Minimum package
- 3000 圆盘
Technical parameters
- Power
- 400mW
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- MMA02040C1653FB300
- Electronic Component
- 1
- Package
- 0204
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.001g
- Electronic Component
- 165kΩ
- Electronic Component
- 1
- Electronic Component
- BM0058431717
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMA02040C1653FB300 — VISHAY 0204 MELF 薄膜精密电阻器 165kΩ 0.4W 1%
一、产品概述
MMA02040C1653FB300 为 VISHAY（威世）系列 0204 封装 MELF 薄膜电阻器，标称阻值 165 kΩ，额定功率 0.4 W，精度 ±1%，温度系数 ±50 ppm/℃，额定工作电压 200 V，工作温度范围 -55℃ 至 +155℃。该器件结合了薄膜工艺的高稳定性与 MELF 圆柱体封装的优良热机械性能，适合对稳定性和可靠性有较高要求的精密场合。
二、主要特性
- 阻值：165 kΩ ±1%
- 额定功率：0.4 W（在额定环境温度下）
- 温度系数：±50 ppm/℃（薄膜工艺，温漂小）
- 工作温度：-55℃ ~ +155℃
- 最大工作电压：200 V（生产者限定）
- 封装：0204 MELF（圆柱体 SMD）
- 工艺特性：薄膜低噪声、长时间稳定性好
三、典型应用
适用于精密测量与信号链中对阻值稳定性要求高的场景：
- 精密电压分压器与参考电路
- 仪器仪表与数据采集前端
- 航空航天与军用电子（高温-高可靠性场合）
- 工业控制、通讯设备及医疗电子
四、使用与装配注意事项
- 电压与功率：理论上由 P·R 可得的最高承受电压约为 sqrt(P·R) ≈ 257 V，但器件额定工作电压由厂家限定为 200 V，实际应用中应以 200 V 为上限，并对长期功耗和脉冲能量做裕量设计。
- 热降容（derating）：高环境温度时需按厂方热降容曲线降低允许功率，避免长时间满载运行；设计时建议留有裕量尤其在脉冲或间歇大电流场合。
- 焊接与机械应力：MELF 封装适应回流焊与波峰焊工艺，但需遵循厂家焊接曲线与 PCB 焊盘设计，避免过大机械应力与热冲击。
- 清洗与维护：焊膏残留应彻底清洗，避免化学品腐蚀端帽或引起电气泄漏。
五、可靠性与选型建议
薄膜 MELF 结构在长期漂移、噪声与热稳定性方面优于一般厚膜产品，适合对精度与可靠性有要求的系统。选型时注意阻值及功率裕度、工作温度范围与最大工作电压的匹配。为获得完整的热降容曲线、机械尺寸与焊接规范，请参考 VISHAY 官方数据手册或与供应商确认样片测试。
如需详细数据手册、封装尺寸图或样品测试建议，可联系供应商或索取 VISHAY 官方资料以完成最终设计验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
