WMSIC Electronic Components

VISHAY BZX55C12-TAP BZX55C12

ModelBZX55C12-TAP
PackageDO-35
BrandVISHAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VISHAY BZX55C12-TAP
Type
DO-35
Minimum package
10000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VISHAY
Electronic Component
BZX55C12-TAP
Electronic Component
1
Package
DO-35
Electronic Component
Zener Diode
Electronic Component
0.14g
Electronic Component
1
(Zzk)
90Ω
(Zzt)
20Ω
Electronic Component
BM0058418031
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
500mW
Electronic Component
11.4V~12.7V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX55C12-TAP 产品概述

一、产品简介

BZX55C12-TAP 是 VISHAY(威世)推出的一款小功率稳压二极管,采用 DO-35 玻璃轴向引线封装,额定稳压值 12V,标称耗散功率 500 mW。该器件属于经典的 BZX55 系列,体积小、成本低、可靠性高,适合用作低功率电压基准、浪涌保护与电压稳压级的被动元件。

二、主要参数

  • 二极管数量:1 个独立式
  • 稳压值(标称):12 V
  • 稳压值范围:11.4 V ~ 12.7 V
  • 反向电流 Ir:100 nA @ 9.1 V(标明的测试条件)
  • 耗散功率 Pd:500 mW(厂家额定)
  • 动态阻抗 Zzt:20 Ω
  • 脉动/拐点阻抗 Zzk:90 Ω
  • 封装:DO-35(玻璃轴向引线)
  • 品牌:VISHAY(威世)

三、特性与优势

  • 精确稳压:标称 12V,稳压值在 11.4V 至 12.7V 范围内,适合一般 12V 参考或保护应用。
  • 低漏电流:在指定条件下反向电流仅 100 nA,适用于对电流消耗敏感的电路(如便携设备或电池供电系统)。
  • 良好动态性能:Zzt≈20 Ω 表明在测试电流下具有较低的动态阻抗,能在工作电流变化时提供较稳的电压输出;Zzk≈90 Ω 反映在拐点或微小电流下的阻抗特性。
  • 通用封装:DO-35 轴向玻璃封装便于通孔焊接、工程试验与长期可靠运行,抗机械冲击与环境老化能力较好。
  • 供应与可靠性:VISHAY 品牌保证了元器件的一致性与可追溯性,适合量产与工程样机。

四、典型应用场景

  • 低功耗电源的局部稳压与基准电压源。
  • 过压保护与钳位电路(例如接口保护、电池充电线路的防浪涌)。
  • 测试与测量设备中作为简单的参考/箝位元件。
  • 工业、家电、通信设备中的小功率稳压需求。
  • 教学与实验平台的通用二极管替代件。

五、热管理与工作限制

  • 额定耗散功率 Pd = 500 mW 表示在厂家指定的测量条件下器件可连续耗散的最大功率。实际允许的电流受稳压电压影响,可由 Imax ≈ Pd / Vz 估算,例如在理想散热下 Imax ≈ 500 mW / 12 V ≈ 41.7 mA。
  • 由于 DO-35 封装的散热能力有限,实际工作电流建议留有裕量,并关注焊盘和环境温度对结温的影响。长时间接近额定耗散会降低器件寿命或导致热失效。
  • 设计时应考虑器件结温与环境温度的关系,必要时采用散热增强措施或改用更大功率的稳压管。

六、封装与安装建议

  • DO-35 玻璃轴向封装利于手工焊接与波峰/选择性焊接。焊接时避免对封装过热,推荐使用短时间的热输入并在距封装一定距离进行焊接。
  • 轴向封装便于在面包板与通孔 PCB 上安装,注意引线弯曲应在引线处而非玻璃体直接施力,以防破裂。
  • 放置与走线时建议优化散热路径,例如增加铜厚或连接到散热良好的铜箔以降低结温。

七、选型参考与可替代型号

  • 若需要更高功率处理能力,可选择相同稳压电压但功率等级更高的稳压二极管系列(如 BZT52、BZT52C 系列或 SMD 更大功率封装)。
  • 对于要求更低动态阻抗或更精确电压参考的应用,建议考虑稳压集成芯片(低压差 LDO 或带参考源的 IC)。
  • 选型时请比对稳压精度、最大耗散、封装形式与温度系数等参数。

八、注意事项与检验建议

  • 在最终设计中,应参照 VISHAY 的原厂数据手册获取完整温度特性曲线、测试条件以及封装尺寸图。
  • 样机验证时建议进行热巡检与稳压精度测试,验证在目标温度与电流条件下的实际稳压值与漏电流。
  • 储存与使用中避免强酸强碱环境与剧烈机械震动,玻璃封装虽耐环境老化但易碎。

以上为 BZX55C12-TAP 的综合概述与工程参考要点,如需对比具体测试曲线、封装尺寸或采购信息,可提供更详细的原厂 datasheet 或进一步指定应用场景以便给出更精确的设计建议。

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