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VISHAY VS-20MQ100-M3/5AT VS-20MQ100-M3
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY VS-20MQ100-M3 / 5AT
- Type
- VISHAY
- Minimum package
- 7500 卷
Technical parameters
- Electronic Component
- VISHAY
- Electronic Component
- VS-20MQ100-M3/5AT
- Electronic Component
- 1
- Package
- DO-214AC(SMA)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.107g
- Electronic Component
- 1
- Electronic Component
- BM0227545572
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 100uA@100V
- (Vf)
- 910mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 7500
- Voltage Rating(Vr)
- 100V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
VS-20MQ100-M3/5AT 产品概述
一、产品简介
VS-20MQ100-M3/5AT 为 VISHAY（威世）出品的高压肖特基整流二极管，采用 DO-214AC（SMA）表面贴装封装，2 引脚结构，适用于中等功率的整流与保护场合。该器件在较高反向电压下仍能保持肖特基器件的快速切换与较低正向压降特性，适合开关电源和整流应用。
二、主要电气参数
- 正向压降 (Vf)：≈ 910 mV @ 2 A
- 额定整流电流：2 A（连续）
- 直流反向耐压 (Vr/RRM)：100 V
- 反向电流 (Ir)：100 μA @ 100 V（典型测量点）
这些参数表明器件在 2 A 工作点下具有相对较低的损耗，同时能承受高达 100 V 的反向电压。需注意反向漏电流随温度上升而显著增加，应在热设计中考虑。
三、封装与热管理
器件封装为 DO-214AC (SMA)，体积小、易于自动贴装。SMA 封装热阻较大，连续 2 A 工作时需关注 PCB 的散热能力：
- 建议使用较宽的铜箔和热沉过孔来扩散结温；
- 在高环境温度或连续大电流情形下，应按厂商数据表对额定电流进行降额处理；
- 波峰/回流焊接工艺应参考 VISHAY 的焊接温度曲线，避免因过热影响可靠性。
四、典型应用
- 开关电源整流与自由轮回路；
- DC–DC 转换器输出整流；
- 逆变器和电源保护电路；
- 通信、电源适配器、工业控制等要求高反压且需低正向损耗的场合。
五、使用注意事项
- 反向漏电随温度急升，热管理不良会导致漏电与功耗增加；
- 启动和浪涌电流（如器件承受的峰值冲击电流）需参照原厂详细数据表并采取限流或软启动措施；
- 正确识别极性（端面标识阴极）并按 PCB 方向布局以降低寄生电感；
- 在高 EMI/快速开关场合，注意与其他器件的布局以减少电磁干扰。
六、总结
VS-20MQ100-M3/5AT 以其 100 V 的耐压能力和在 2 A 工作点下的较低正向压降，适合多种中等功率整流与保护用途。选型时请结合系统工作温度、散热条件及浪涌要求，参考 VISHAY 官方数据表进行最终验证。
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