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VISHAY MMB02070C1000FB200
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VISHAY MMB02070C1000FB200
- Type
- VISHAY
- Minimum package
- 2000 圆盘
Technical parameters
- Power
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- VISHAY
- Electronic Component
- MMB02070C1000FB200
- Electronic Component
- 1
- Package
- MELF-0207
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.11g
- Electronic Component
- 100Ω
- Electronic Component
- 1
- Electronic Component
- BM0229350166
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMB02070C1000FB200 产品概述
一、产品简介
MMB02070C1000FB200 是 VISHAY（威世）推出的一款高稳定性薄膜电阻，采用 MELF-0207 圆柱形表贴封装（也标注为 2309）。该型号为 100 Ω、精度 ±1%、温度系数 ±50 ppm/°C 的精密电阻，具备抗硫化特性并满足汽车级 AEC‑Q200 要求，适用于对长期稳定性和环境可靠性有较高要求的场合。
二、主要技术参数
- 电阻值：100 Ω
- 精度：±1%
- 温度系数（TCR）：±50 ppm/°C
- 工作温度范围：-55℃ 至 +155℃
- 封装：MELF-0207（SMD）
- 抗硫化：Sulfur Resistant（适于含硫环境）
- 汽车级认证：AEC‑Q200
- 交付形式：T/R（卷带）
- 品牌：VISHAY（威世）
说明：资料中对额定功率有不同表述（描述出现 0.4W，基础参数有 1W），实际可耗散功率受 PCB 散热、贴装方式及工况影响，设计时建议以制造商最新数据表和 PCB 实测为准。
三、性能与可靠性
薄膜工艺带来较低的噪声、优异的长期稳定性和较小的温漂，±50 ppm/°C 的 TCR 使其在精密测量和稳定电路中表现良好。MELF 封装本身抗脉冲能力强且热稳定性好，结合抗硫化处理可在工业及汽车含硫环境中显著降低失效风险。通过 AEC‑Q200 认证，表明该器件满足汽车电子在温度循环、机械应力和湿热等残酷工况下的可靠性要求。
四、典型应用场景
- 汽车电子（传感器前端、电源分压、精密采样）
- 工业控制与仪器仪表（精密电阻分压、校准网络）
- 通信设备与测试测量（低噪声参考、电流检测）
- 高可靠性嵌入式系统（恶劣环境下的阻值元件）
五、封装与使用建议
- MELF 封装需使用合适的真空吸笔或专用取放头进行贴装，避免机械冲击与侧向摩擦。
- 焊接推荐遵循元件厂家的回流温度曲线，注意预热与冷却速率以防开裂或应力导致性能漂移。
- 设计 PCB 热属性时考虑热阻，必要时通过加铜、热盲孔等方式改善散热以提高允许功率。
- 在含硫或腐蚀性环境中使用其抗硫化特性，但仍应配合良好封装与防护方案以延长寿命。
总结：MMB02070C1000FB200 以其薄膜工艺、优良温漂、抗硫化特性和汽车级可靠性，适合对精度、稳定性和环境耐受性有严格要求的应用场合。选型时请参考最新 VISHAY 数据表并根据实际散热与工况核定额定功率。
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