WMSIC Electronic Components

Viking ARG02DTC7500

ModelARG02DTC7500
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG02DTC7500
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG02DTC7500
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.009g
Electronic Component
750Ω
Electronic Component
1
Electronic Component
BM0265649478
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉ARG02DTC7500薄膜电阻产品概述

一、产品定位与核心属性

ARG02DTC7500是Viking(光颉)推出的精密薄膜表面贴装电阻,针对高密度PCB设计、宽温环境应用需求打造,属于光颉薄膜电阻系列中的通用精密型号。其核心定位是在小型化封装下实现高精度、低温度漂移与宽温可靠性,适配汽车电子、工业控制、消费电子等多领域的低功耗精密电路。

二、核心参数详解

该电阻的关键参数围绕“精密稳定”与“小型化适配”设计,具体如下:

  • 阻值与精度:固定阻值750Ω,精度±0.5%,满足多数信号调理、分压电路的误差要求;
  • 功率与电压:额定功率62.5mW(0402封装典型功率值),最大工作电压50V,在小体积下实现了功率与电压的平衡;
  • 温度特性:温度系数(TCR)±25ppm/℃,阻值随温度变化极小;工作温度范围-55℃~+155℃,覆盖工业级与汽车级的极端温度场景;
  • 封装规格:0402英制封装(对应公制1005),尺寸约1.0mm×0.5mm×0.35mm,适配自动化SMT生产。

三、性能特点

  1. 高精度与低漂移:±0.5%的精度确保电路信号无明显误差,25ppm/℃的TCR可避免温度变化(如汽车发动机舱120℃以上环境)导致的阻值波动,保障电路长期稳定;
  2. 小型化适配高密度设计:0402封装体积仅为0603封装的1/4左右,可显著减少PCB占用空间,适合智能手机、智能穿戴等便携设备的紧凑布局;
  3. 宽温可靠性:-55℃至+155℃的工作范围,经过光颉严格的温度循环测试(如-55℃~155℃循环500次),满足汽车级(AEC-Q200可选)与工业级可靠性要求;
  4. 薄膜电阻技术优势:采用镍铬薄膜工艺,相比碳膜电阻具有更低的噪声(典型值<0.1μV/√Hz)、更高的高频稳定性(截止频率可达10GHz以上),适合射频信号处理电路;
  5. 环保与合规:符合RoHS 2.0、REACH等环保标准,无铅封装(Sn-Pb或纯锡镀层可选),适配全球市场需求。

四、典型应用场景

ARG02DTC7500的性能适配多领域低功耗精密电路,典型应用包括:

  1. 汽车电子:车身控制系统(BCM)的传感器信号调理、胎压监测系统(TPMS)的分压电路、车载摄像头的滤波电路(宽温适配发动机舱与冬季低温环境);
  2. 工业控制:PLC模块的模拟量输入电路、温度传感器(如PT100)的信号放大电路、小型伺服电机的驱动反馈电路;
  3. 消费电子:智能手机的音频滤波电路、智能手表的心率传感器信号调理、无线耳机的射频匹配网络;
  4. 通信设备:基站射频前端的衰减器、路由器的电源分压电路、光纤收发器的信号调理电路;
  5. 医疗电子:便携式血糖仪的检测电路、小型监护仪的信号放大电路(高精度需求避免检测误差)。

五、封装与可靠性说明

该电阻采用0402表面贴装封装,具备以下可靠性优势:

  • 封装结构:陶瓷基底+薄膜电阻层+电极镀层,结构稳定,抗振动能力强(符合MIL-STD-202振动测试标准);
  • 焊接兼容性:适配回流焊、波峰焊等SMT工艺,焊接温度范围220℃~260℃(符合IPC标准);
  • 长期稳定性:经1000小时高温负载测试(125℃+额定功率),阻值变化率<0.1%,确保产品寿命周期内性能稳定。

六、选型与使用注意事项

  1. 功率余量:实际应用中需计算电阻功耗(P=I²R=V²/R),建议留20%~30%余量(如实际功耗≤50mW),避免过热导致阻值漂移;
  2. 电压限制:最大工作电压50V为额定值,若电路电压波动可能超过此值,需串联保护元件或选择更高电压型号;
  3. 温度范围匹配:若应用场景温度超出-55℃~+155℃(如航空航天的超低温环境),需考虑光颉同系列宽温型号(如ARG02DTX系列);
  4. 精度升级:若需±0.1%或±0.05%的更高精度,可选择光颉ARG02DTH系列(相同封装下精度更高)。

总结

ARG02DTC7500作为光颉薄膜电阻的代表性型号,以“小型化+高精度+宽温稳定”为核心竞争力,覆盖了从消费电子到汽车工业的多场景需求。其平衡的功率与电压参数、可靠的封装设计,使其成为高密度PCB设计中替代传统碳膜电阻的理想选择,尤其适合对温度稳定性要求较高的精密电路。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.