WMSIC Electronic Components

Viking ARG02FTC3901

ModelARG02FTC3901
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG02FTC3901
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG02FTC3901
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
3.9kΩ
Electronic Component
1
Electronic Component
BM0265649550
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG02FTC3901产品概述

ARG02FTC3901是光颉(Viking)品牌推出的0402封装薄膜贴片电阻,针对小功率、高精度电路场景优化,具备宽温适应性与稳定的电气性能,是工业控制、消费电子、汽车电子等领域的常用基础器件。

一、产品定位与基本属性

ARG02FTC3901定位于通用型高精度小功率贴片电阻,核心属性清晰明确:

  • 品牌:光颉(Viking),国内被动元器件领域的成熟厂商,产品以一致性与可靠性著称;
  • 封装:0402(英制尺寸,对应公制1005),体积紧凑(约1.0mm×0.5mm),适配高密度PCB布局;
  • 类型:薄膜电阻(采用真空镀膜工艺制造),区别于碳膜、金属膜电阻,具备更低噪声与更高长期稳定性。

二、核心电气参数详解

ARG02FTC3901的关键参数覆盖阻值、精度、功率等核心维度,各项指标均针对实际应用场景优化:

  1. 阻值与精度:标称阻值3.9kΩ(四位代码标识为“3901”,即390×10¹=3900Ω),精度±1%——在25℃标准温度下,阻值偏差不超过39Ω,满足大多数精密电路(如信号调理、分压反馈)的精确要求;
  2. 功率与电流:额定功率62.5mW,最大允许电流约4mA(计算公式:I=√(P/R)=√(62.5e-3/3900)≈4.0mA),适配小信号电路(如传感器输出、MCU周边);
  3. 工作电压:最大工作电压50V,超过该值可能导致电阻击穿损坏,应用时需确保电路电压不超限;
  4. 温度系数(TCR):±25ppm/℃,即温度每变化1℃,阻值变化±25×10⁻⁶倍——以100℃温差为例,阻值变化约0.975Ω(0.025%),远优于普通碳膜电阻(通常TCR≥±500ppm/℃);
  5. 工作温度范围:-55℃+155℃,覆盖工业级(-40℃+85℃)与汽车级(-40℃~+125℃)温区,可适应极端环境下的稳定工作。

三、关键性能优势

ARG02FTC3901的性能优势源于薄膜电阻工艺与参数优化,主要体现在以下几点:

  1. 高稳定性:薄膜电阻采用真空沉积技术,阻值一致性好,长期漂移小(通常低于0.1%/1000小时),适合需要长期可靠工作的场景;
  2. 低噪声特性:薄膜电阻的噪声系数远低于碳膜电阻,可减少信号电路中的干扰,提升小信号检测精度;
  3. 紧凑封装适配性:0402封装体积小,可在有限PCB空间内实现高密度电阻布局,满足小型化设备(如蓝牙耳机、智能手环)的设计需求;
  4. 宽温适应性:-55℃~+155℃的工作范围,可覆盖工业现场(如户外传感器)、汽车引擎舱周边等高温/低温环境。

四、典型应用场景

ARG02FTC3901因参数适配性强,广泛应用于多领域的基础电路:

  1. 工业控制:PLC输入输出模块的分压电路、传感器信号调理电路(如温度传感器、压力传感器的信号放大反馈);
  2. 消费电子:智能手机/平板的电源管理电路(如电池充电反馈分压)、蓝牙耳机的音频信号调理;
  3. 汽车电子:仪表盘传感器信号处理、车载导航的低功耗模块(如CAN总线终端电阻);
  4. 通信设备:5G基站小型模块的射频周边电路、路由器的信号分压网络;
  5. 医疗电子:小型医疗设备(如血糖仪)的信号检测电路(需精度与稳定性)。

五、可靠性与环境适应性说明

ARG02FTC3901符合电子元器件的可靠性标准,具体表现为:

  • 耐温性能:工作温度上限155℃,可承受短时间高温冲击(如焊接过程中的峰值温度);
  • 无铅工艺:采用RoHS compliant无铅封装,符合环保要求,适配全球市场;
  • 长期可靠性:薄膜电阻的工艺特性使其在长期工作中阻值漂移极小,适合需要持续稳定运行的设备(如工业自动化系统)。

综上,ARG02FTC3901以高精度、小体积、宽温稳定为核心优势,是小功率电路场景中替代普通电阻的优选器件,可满足多领域的基础电阻需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.