Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Viking ARG02FTC4700
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Viking ARG02FTC4700
- Type
- VIKING
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- VIKING
- Electronic Component
- ARG02FTC4700
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 470Ω
- Electronic Component
- 1
- Electronic Component
- BM0264911608
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ARG02FTC4700 产品概述
一、产品简介
ARG02FTC4700 是 Viking(光颉) 出品的一款高精度薄膜贴片电阻，阻值为 470Ω，精度 ±1%，额定功率 62.5mW，额定工作电压 50V，温度系数 (TCR) ±25ppm/℃，工作温度范围 -55℃ 至 +155℃。器件采用 0402 封装（约 1.0mm × 0.5mm），适合高密度 SMT 布局与微型化电子设备。
二、结构与关键特性
- 薄膜工艺：薄膜电阻薄膜沉积与精密激光修整，具有低噪声、高稳定性与良好的长期漂移特性。
- 高精度：公差 ±1% 满足多数精密模拟与测量电路对阻值精度的需求。
- 低温漂：±25ppm/℃ 的 TCR 在温度变化环境下可保持很好的阻值稳定性，利于精密电路（如分压、采样网络）使用。
- 小型封装：0402 小体积节省 PCB 面积，适合便携与高密度模块。
- 宽温度范围：-55℃ ~ +155℃ 适应工业级与严苛环境应用。
三、电气与热特性（概要）
- 阻值：470Ω
- 精度：±1%
- 额定功率：62.5mW（在额定环境温度下）
- 最大工作电压：50V
- 温度系数：±25ppm/℃
- 工作温度：-55℃ ~ +155℃
注：在高环境温度下应按厂家提供的降额曲线进行功率降额，常见做法为从额定参考温度起线性降额以保证可靠性。
四、典型应用场景
- 精密模拟电路：分压器、基准源匹配、滤波网络。
- 测量与传感接口：与放大器、ADC 前端配合，提升系统精度与稳定性。
- 通信与消费电子：阻抗配合、偏置网络、功耗受限的便携终端。
- 工业与汽车电子（非高功率场合）：在温度与可靠性要求较高的环境中使用。
五、封装、焊接与使用建议
- 封装尺寸：0402（约 1.0mm × 0.5mm），建议按照行业推荐的 0402 焊盘设计布局，以确保焊点可靠性。
- 焊接工艺：可兼容无铅回流焊工艺（建议遵循器件在回流温度和时长方面的厂方推荐参数）。
- 使用注意：避免过度机械应力（在贴装、波峰或剪切时），清洗时选用对金属层无腐蚀的溶剂；过高的长期工作温度或超过功率/电压极限可能导致寿命下降。
六、包装与订购信息
- 常见包装：卷带（Tape & Reel），适用于自动贴片机；具体卷盘数量与包装型号请在订购时确认。
- 型号标识示例：ARG02FTC4700（品牌：Viking / 光颉）
- 如需样品、批量报价或器件可靠性数据（如热阻、降额曲线、寿命测试报告等），建议联系供应商获取最新技术资料与应用支持。
总结：ARG02FTC4700 结合薄膜工艺的低噪声与低温漂优势、高精度 ±1% 与小型 0402 封装，适合对体积与精度同时有要求的电子设计。在使用中请关注回流焊工艺与温度降额，以确保长期稳定可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
