WMSIC Electronic Components

Viking ARG03BTC0100

ModelARG03BTC0100
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03BTC0100
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03BTC0100
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.023g
Electronic Component
10Ω
Electronic Component
1
Electronic Component
BM0263676895
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03BTC0100薄膜贴片电阻产品概述

ARG03BTC0100是Viking(光颉)推出的一款高精度薄膜贴片电阻,采用0603小封装设计,专为对阻值精度、温度稳定性要求较高的电子电路场景打造。以下从核心参数、产品特性、应用场景等维度展开详细概述。

一、核心参数精准梳理

ARG03BTC0100的关键参数均围绕高精度、宽温稳定的设计目标展开,具体如下:

参数类别 具体参数说明 电阻类型 薄膜电阻(镍铬/钌基薄膜工艺) 标称阻值 10Ω(±0.1%精度) 额定功率 100mW(25℃环境下额定值) 最大工作电压 75V(直流/交流峰值) 温度系数(TCR) ±25ppm/℃(-55℃~+155℃范围) 工作温度范围 -55℃ ~ +155℃(工业级宽温) 封装规格 0603(英制:0.06×0.03英寸;公制:1608) 品牌 Viking(光颉)

核心参数亮点:±0.1%精度可满足精密测量场景;±25ppm/℃温系意味着温度变化100℃时,阻值偏差仅0.25%,稳定性远超普通碳膜电阻。

二、产品特性深度解析

ARG03BTC0100的性能优势源于薄膜电阻的工艺特性与Viking的制造积淀,主要体现在以下几点:

1. 高精度与低漂移

薄膜电阻通过真空溅射形成均匀电阻膜,相比碳膜、金属膜电阻,阻值一致性更好。ARG03BTC0100的±0.1%精度可直接用于医疗设备、校准仪器等对阻值偏差要求严格的场景;±25ppm/℃的TCR则避免了温度波动(如工业车间的昼夜温差)对电路性能的干扰。

2. 小封装高密度集成

0603封装尺寸仅1.6mm×0.8mm,是贴片电阻的主流小封装之一,适合智能手机、穿戴设备、5G基站等对PCB空间要求苛刻的高密度集成场景,可有效缩小电路体积,提升产品便携性或集成度。

3. 宽温适应性与可靠性

工作温度范围覆盖-55℃至+155℃,远超消费级电阻(通常0~70℃),可稳定工作于:

  • 工业现场的低温环境(如北方户外设备);
  • 汽车发动机舱的高温环境(可达120℃以上); 结合Viking的防潮、抗老化工艺,产品长期可靠性(MTBF)可达10^6小时以上。

4. 低噪声与抗干扰

薄膜电阻的噪声系数(通常<0.1μV/√Hz)远低于碳膜电阻,适合信号调理、射频电路等对噪声敏感的场景,不会引入额外干扰,保证电路信号质量。

三、封装与品牌背景

1. 0603封装的工艺兼容性

0603封装采用标准贴片结构,焊接兼容性好:

  • 支持回流焊(峰值温度≤260℃,持续时间≤10秒);
  • 支持波峰焊(温度≤245℃);
  • 可通过自动化贴片机高速生产,适合批量制造。

2. Viking(光颉)的品牌支撑

Viking是全球被动元器件领域的专业厂商,专注电阻、电感研发20余年,其薄膜电阻产品广泛应用于汽车电子、工业控制、医疗设备等高端领域。ARG03BTC0100继承了品牌的无铅工艺(符合RoHS标准)与严格的出厂测试(每批次抽样检测精度、温系),品质可追溯。

四、典型应用场景

ARG03BTC0100的性能匹配多领域的精密电路需求,核心应用包括:

1. 工业控制与自动化

  • PLC(可编程逻辑控制器)的信号输入调理电路;
  • 传感器(如压力、温度传感器)的信号放大电路;
  • 工业机器人的伺服驱动反馈电路。

2. 汽车电子

  • 车载仪表盘的传感器信号链路;
  • 车载通信模块(如CAN总线)的终端匹配电阻;
  • 汽车LED大灯的电流调节电路。

3. 医疗设备

  • 监护仪的心率/血氧信号采集电路;
  • 血糖仪的血糖浓度测量校准电路;
  • 输液泵的流量控制电路。

4. 消费电子与通信

  • 智能手机的电源管理模块(如电池保护电路);
  • 5G基站的射频前端匹配电路;
  • 智能穿戴设备的传感器信号处理电路。

五、选型与使用注意事项

为保证产品性能与寿命,使用时需注意以下几点:

1. 功率降额

额定功率100mW为25℃环境下的最大值,实际使用需根据温度降额:

  • 70℃环境:功率降至70mW(70%额定值);
  • 125℃环境:功率降至50mW(50%额定值); 避免电阻过热导致阻值漂移或烧毁。

2. 电压限制

最大工作电压75V为直流/交流峰值,不得超过,否则可能导致电阻薄膜击穿。

3. 存储条件

建议存储于温度-20℃+30℃、相对湿度30%70%的干燥环境,避免受潮影响焊接性能(如引脚氧化)。

ARG03BTC0100凭借高精度、宽温稳定、小封装等优势,成为工业控制、汽车电子、医疗设备等领域工程师选型的优质方案,可有效提升电路的精度与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.