WMSIC Electronic Components

Viking ARG02BTC4702

ModelARG02BTC4702
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG02BTC4702
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG02BTC4702
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.009g
Electronic Component
47kΩ
Electronic Component
1
Electronic Component
BM0264480902
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG02BTC4702薄膜贴片电阻产品概述

一、产品基本定位

ARG02BTC4702是Viking(光颉)电子推出的高精度薄膜贴片电阻,针对对阻值精度、温度稳定性及小型化要求严苛的电子电路设计。该产品采用真空沉积薄膜工艺制造,结合0402小型封装,可适配从消费电子到工业控制的多场景应用,是精密信号调理、低功耗电路的理想选择。

二、核心技术参数梳理

ARG02BTC4702的关键参数明确了性能边界,具体如下:

  1. 阻值与精度:固定阻值47kΩ(47×10³Ω),精度等级达±0.1%——远高于常规贴片电阻的±1%/±5%标准,可满足精密测量、信号放大等场景的精准度需求;
  2. 功率与电压:额定功率62.5mW,最大工作电压50V,适配低功耗电路设计,避免过载导致的性能衰减或损坏;
  3. 温度系数(TCR):±25ppm/℃,表示温度每变化1℃,阻值变化量约1.175Ω(47kΩ×25×10⁻⁶),宽温环境下阻值稳定性优异;
  4. 工作温度范围:-55℃至+155℃,覆盖极端温度场景(如汽车低温启动、工业高温环境);
  5. 封装形式:0402英制封装(对应公制1005),尺寸仅0.04英寸×0.02英寸(1.0mm×0.5mm),便于高密度PCB布局。

三、核心性能优势

ARG02BTC4702的性能优势源于薄膜工艺与参数设计的结合,主要体现在:

  1. 高精度与低漂移:±0.1%精度及±25ppm/℃ TCR,确保电路信号准确传递——例如在万用表电压采样电路中,可有效降低测量误差;
  2. 宽温环境适应性:-55℃至+155℃的工作范围,满足汽车电子(车载传感器)、工业控制(PLC反馈电路)等极端温度场景的稳定运行;
  3. 小型化设计:0402封装体积仅为常规0805封装的1/4,可显著节省PCB空间,适配智能手机、可穿戴设备等便携产品的高密度布局;
  4. 低功耗适配:62.5mW额定功率,与IoT设备、低功耗传感器节点的功耗需求匹配,无需额外降额设计;
  5. 薄膜工艺可靠性:真空沉积工艺制造的薄膜电阻,相比碳膜/金属膜电阻,具有更低噪声、更好长期稳定性及耐老化性能,可延长设备使用寿命。

四、典型应用场景

ARG02BTC4702的性能特点使其适用于多领域精密电路:

  1. 精密测量仪器:示波器、数字万用表、信号发生器的信号采样/放大电路,依赖其高精度阻值实现准确测量;
  2. 汽车电子:车载压力/温度传感器的信号调理电路,宽温范围可应对汽车行驶中的极端温度变化;
  3. 消费电子:智能手机、平板电脑的电源管理模块、射频前端电路,小型化封装适配设备轻薄化设计;
  4. 工业控制:PLC、伺服驱动器的反馈回路,稳定的阻值性能确保控制精度;
  5. IoT与低功耗设备:智能传感器节点、可穿戴健康设备的信号放大电路,低功耗与小型化优势显著。

五、品牌与封装说明

  • 品牌背景:Viking(光颉)是全球知名被动元件制造商,专注电阻、电容研发生产,ARG系列电阻以高可靠性、高精度著称,广泛应用于汽车、工业、消费电子领域;
  • 封装工艺:0402封装采用表面贴装技术(SMD),无引脚设计减少寄生电感/电容,适合高频电路;同时兼容自动化贴装设备,提高生产效率,降低焊接不良率。

ARG02BTC4702以精准阻值、优异温稳性、小型化及低功耗特性,成为多场景电子电路的可靠选择,适配从消费电子到工业控制的多样化需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.