WMSIC Electronic Components

Viking ARG02BTC9100

ModelARG02BTC9100
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG02BTC9100
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG02BTC9100
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.009g
Electronic Component
910Ω
Electronic Component
1
Electronic Component
BM0265378755
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG02BTC9100 贴片薄膜电阻产品概述

ARG02BTC9100是Viking(光颉) 推出的一款高精度小型化贴片薄膜电阻,针对对阻值精度、温度稳定性及空间占用有严格要求的电子电路设计,采用0402标准封装,兼顾性能与密度,适用于消费电子、工业控制、医疗及通信等多领域。

一、产品定位与核心属性

ARG02BTC9100属于光颉薄膜电阻系列中的高精度小功率型号,核心定位为:

  • 满足**±0.1%高阻值精度**需求的电路(如精密分压、低电流采样);
  • 适配0402封装密度的高密度PCB设计(如便携式设备、小型模块);
  • 覆盖宽温度范围的稳定工作(-55℃~+155℃)。

相比同封装厚膜电阻,其温度系数更低、长期阻值漂移更小,更适合对信号精度敏感的场景。

二、关键性能参数详解

本型号的核心参数围绕“高精度、小体积、宽温稳定”设计,关键指标如下:

2.1 阻值与精度

  • 标称阻值:910Ω(标准E96系列阻值,可满足多数精密电路的分压/分流需求);
  • 精度等级:±0.1%(即阻值偏差不超过±0.91Ω),属于工业级高精度范畴,远高于普通电阻的±1%/±5%精度,可降低电路系统误差。

2.2 功率与电压

  • 额定功率:62.5mW(0402封装典型功率规格,适配低功耗电路);
  • 最大工作电压:50V(需注意:实际工作电压需同时满足功率限制,即最大允许电压为√(P×R)=√(0.0625×910)≈7.5V,50V为绝对最大额定电压,不可超过)。

2.3 温度特性

  • 温度系数(TCR):±25ppm/℃(即温度每变化1℃,阻值变化约0.02275Ω);
  • 工作温度范围:-55℃~+155℃,覆盖工业级(-40℃~+85℃)及扩展温区,适合极端环境应用(如户外设备、高温工业现场)。

三、封装与工艺特点

ARG02BTC9100采用0402英制贴片封装(对应公制1005封装),尺寸为0.04英寸×0.02英寸(1.0mm×0.5mm),工艺上具备以下优势:

  1. 薄膜电阻工艺:采用镍铬(NiCr)薄膜材料,通过真空溅射沉积于氧化铝陶瓷基底,阻值稳定性优于厚膜电阻;
  2. 激光微调阻值:生产过程中通过激光刻蚀微调薄膜,保证±0.1%精度,避免机械调节的漂移风险;
  3. 端电极结构:采用三层电极设计(镍/锡镀层),兼容回流焊、波峰焊工艺,焊接可靠性符合IPC-A-610标准;
  4. 小型化设计:0402封装体积仅为0603封装的1/4,可显著提升PCB布局密度,适配便携式设备的紧凑空间。

四、典型应用场景

ARG02BTC9100的参数特性使其适配以下场景:

  1. 便携式电子设备:智能手机、智能手表的传感器信号调理(如加速度计、气压计)、电源反馈回路(如电池管理系统的电压采样);
  2. 工业控制模块:PLC的模拟量输入输出电路、温度传感器的信号放大(宽温环境下阻值稳定,减少温漂误差);
  3. 医疗电子设备:监护仪的心率/血氧信号处理、输液泵的流量控制电路(精度要求高,避免信号失真);
  4. 通信设备:基站射频前端的信号衰减网络、光纤收发器的偏置电路(小型化需求,同时保证信号精度);
  5. 汽车辅助电子:车载中控的按键感应电路、后视镜调节模块(部分场景可兼容-40℃~+125℃汽车级温区)。

五、可靠性与环境适应性

本型号具备良好的可靠性,满足以下环境与寿命要求:

  • 温度循环:符合JESD22-A104标准,经过-55℃~+155℃循环测试(循环次数≥1000次),阻值漂移率≤0.1%;
  • 湿度耐受性:湿度敏感度等级(MSL)为1级(可长期暴露于常温常湿环境,无需干燥包装);
  • 振动与冲击:通过振动测试(10~2000Hz,加速度2g)及冲击测试(1500g,0.5ms),适合移动或工业振动环境;
  • 长期稳定性:在125℃下老化1000小时,阻值漂移≤0.05%,适合长期运行的设备(如工业控制器、医疗设备)。

六、选型匹配参考

若需替换或拓展,可参考以下匹配逻辑:

  • 若需更高功率(如1/10W=100mW),可选择同阻值的0603封装型号(如Viking ARG03BTC9100);
  • 若需更低温漂(如±10ppm/℃),可选择光颉高精度系列(如ARG02BFC9100);
  • 若需更大阻值范围,可查看光颉薄膜电阻的E96/E24系列完整阻值表(覆盖1Ω~10MΩ);
  • 若应用于汽车级场景,需确认是否符合AEC-Q200认证(本型号未明确标注,需咨询供应商)。

ARG02BTC9100以其高精度、小体积、宽温稳定的特性,成为小型化高精度电路设计的优选元件,可有效平衡性能与成本,适配多领域的实际需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.