WMSIC Electronic Components

Viking AR02BTC1001

ModelAR02BTC1001
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR02BTC1001
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR02BTC1001
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.009g
Electronic Component
1kΩ
Electronic Component
1
Electronic Component
BM0263676873
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR02BTC1001薄膜贴片电阻产品概述

一、产品基本定位

AR02BTC1001是Viking(光颉)品牌推出的0402封装高精度薄膜贴片电阻,属于工业级精密电阻范畴,主打「小体积+高稳定性+低温度漂移」核心特性,适配各类对阻值精度、环境适应性要求严苛的电子电路设计,是高密度PCB布局、宽温场景应用的优选器件。

二、核心性能参数详解

该型号电阻的关键参数直接对应实际应用价值,具体解析如下:

  • 阻值与精度:标称阻值1kΩ(E96系列标准阻值),精度±0.1%,可满足精密信号调理、校准电路的误差控制需求(如模拟量采集系统的基准分压,可将采样误差控制在0.1%以内);
  • 功率与电压:额定功率62.5mW(0.0625W),最大工作电压25V,实际应用需遵循功率降额原则(环境温度超过70℃时,功率需按曲线降额至额定值的80%以下),避免过功耗导致阻值漂移;
  • 温度特性:温度系数(TCR)±25ppm/℃,即温度每变化1℃,阻值变化±25×10⁻⁶Ω(以1kΩ为例,100℃温差下阻值变化≤±2.5Ω),适合宽温环境下的稳定工作;
  • 工作温度范围:-55℃至+155℃,覆盖工业级(-40+85℃)、汽车级(-55+125℃)及部分高温场景(如功率模块周边),环境适应性远超常规消费级电阻。

三、封装与工艺特点

3.1 封装规格

采用0402英制贴片封装(对应公制1005,尺寸约1.0mm×0.5mm×0.35mm),体积仅为常规0805封装的1/4,可有效节省PCB布局空间,适配高密度电路设计(如智能手机射频模块、小型化工业传感器)。

3.2 薄膜电阻工艺

相比厚膜电阻,薄膜工艺通过真空溅射形成电阻层,具有三大核心优势:

  • 阻值一致性更好,批次间偏差≤0.05%,避免批量生产的性能波动;
  • 温度系数更低,宽温下阻值稳定,减少环境温度对电路的影响;
  • 噪声系数低(典型值<0.1μV/√Hz),不干扰微弱信号(如音频前置放大、生物电信号采集)。

3.3 端电极设计

端电极采用无铅锡银铜(Sn-Ag-Cu)合金,符合RoHS环保标准,兼容回流焊、波峰焊等自动化贴装工艺,焊接可靠性高(焊点剪切强度≥15N),长期使用无脱焊风险。

四、典型应用场景

AR02BTC1001的特性使其适配多领域精密电路,具体场景如下:

  1. 工业控制:PLC模拟量输入模块的基准分压电阻、温度传感器(如PT100)信号调理电路;
  2. 通信设备:5G小基站射频前端匹配网络、光模块收发电路的偏置电阻;
  3. 精密仪器:示波器校准电路、信号发生器衰减网络、高精度万用表分压电阻;
  4. 消费电子:Hi-Fi耳机放大器前置滤波电阻、智能穿戴设备传感器信号调理;
  5. 汽车电子:车载胎压监测/氧传感器信号放大电阻、仪表盘背光控制限流电阻。

五、可靠性与品牌优势

Viking光颉作为专业电阻制造商,AR02BTC1001通过多项严苛可靠性测试:

  • 负载寿命测试:额定功率+70℃环境下工作1000小时,阻值变化≤±0.1%;
  • 温度循环测试:-55℃~+155℃循环1000次,阻值变化≤±0.05%;
  • 振动冲击测试:符合IEC 60068-2-6(振动)、IEC 60068-2-27(冲击)标准,抗机械应力能力强。

此外,产品供货稳定,常规规格库存充足,支持E96系列定制化阻值,适配不同设计需求。

该型号电阻凭借「高精度、小体积、宽温稳定」的综合优势,已成为工业、通信、汽车电子等领域的主流精密电阻选择之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.