WMSIC Electronic Components

Viking AR02BTC4703

ModelAR02BTC4703
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR02BTC4703
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR02BTC4703
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.009g
Electronic Component
470kΩ
Electronic Component
1
Electronic Component
BM0264480890
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR02BTC4703 薄膜贴片电阻产品概述

一、产品核心身份与品牌基础

AR02BTC4703是光颉电子(Viking) 推出的高精密薄膜贴片电阻,型号中:

  • “AR02”对应品牌系列定位;
  • “BTC”明确为薄膜电阻(Thin Film) 工艺;
  • “4703”表示阻值为470kΩ(470×10³Ω)。

作为光颉在小型化精密电阻领域的代表产品,其依托真空溅射、光刻等成熟工艺,兼顾高精度、宽温稳定性与小体积特性,适配工业、通信、便携电子等多领域需求。

二、关键电气性能参数解析

该电阻核心参数围绕“精密稳定”设计,具体如下:

1. 阻值与精度

阻值为470kΩ,精度等级达**±0.1%** —— 薄膜电阻通过均匀沉积电阻膜实现低误差,远优于碳膜电阻(±1%~±5%),可满足精密测量、信号调理等对阻值一致性要求严苛的场景。

2. 功率与电压规格

  • 额定功率:62.5mW(1/16W),适配0402封装的典型功率上限;
  • 最大工作电压:25V。
    注意:实际使用需同时满足“功率≤62.5mW”与“电压≤25V”(如25V时实际功率≈1.33mW,远低于额定值,可安全工作)。

3. 温度系数(TCR)

温度系数为**±25ppm/℃**,即温度每变化1℃,阻值漂移约11.75Ω(0.0025%)。该指标显著优于普通电阻(如碳膜TCR通常±200ppm/℃以上),确保宽温下电路性能稳定。

4. 工作温度范围

覆盖**-55℃~+155℃**,符合工业级器件标准,可适应户外设备(光伏逆变器、车载传感器)、高温工业模块等恶劣环境,无需额外降额。

三、封装与物理特性

采用0402封装(英制:0.04″×0.02″,公制:1.0mm×0.5mm),是贴片电阻中的小型化封装之一。小体积特性使其可高密度布局于PCB,特别适合便携电子(智能手机、智能手表)、微型传感器模块等对空间要求苛刻的设计。

四、典型应用场景

结合参数特性,AR02BTC4703主要适用于:

  1. 精密测量电路:压力/温度传感器的信号调理(分压、限流),±0.1%精度保障测量准确性;
  2. 工业控制模块:PLC输入输出、电机驱动辅助电路,宽温范围适配车间/户外环境;
  3. 通信设备:基站射频模块的阻抗匹配、信号衰减,稳定TCR保障信号传输质量;
  4. 便携电子:蓝牙耳机、智能手环的电源管理、传感器接口,0402封装实现小型化。

五、产品优势总结

  1. 高精度稳定:±0.1%精度+±25ppm/℃ TCR,满足精密电路核心需求;
  2. 宽温适配:-55℃~+155℃工业级温区,覆盖多数恶劣场景;
  3. 小型化集成:0402封装提升PCB集成度,适配小型化设计趋势;
  4. 品牌可靠:光颉Viking薄膜电阻工艺成熟,长期使用稳定性与一致性突出。

该产品凭借高性价比与稳定性能,成为工业控制、通信、便携电子等领域精密电路设计的优选元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.