WMSIC Electronic Components

Viking AR02BTC5001

ModelAR02BTC5001
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR02BTC5001
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
63mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR02BTC5001
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.009g
Electronic Component
5kΩ
Electronic Component
1
Electronic Component
BM0263676899
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉AR02BTC5001薄膜贴片电阻产品概述

一、产品核心定位与身份

AR02BTC5001是Viking(光颉)推出的高精密小功率薄膜贴片电阻,针对对阻值精度、温度稳定性要求严苛的电子电路设计,采用成熟薄膜工艺制造,兼具小体积与高可靠性,是高密度PCB设计的优选元件之一。

二、关键性能参数深度解析

该电阻的核心参数直接体现应用适配性,各指标具体意义如下:

  1. 阻值与精度:标称阻值为5kΩ,精度等级达±0.1%——常温下实际阻值偏差不超过5Ω(5000Ω×0.1%),远优于普通碳膜电阻(±5%~±1%),可满足精密阻抗匹配、信号校准等场景的误差控制需求。
  2. 功率与电压:额定功率63mW,最大工作电压50V——适配小信号电路(如模拟放大、电源反馈),避免功率过载烧毁风险,符合便携设备的低功耗设计需求。
  3. 温度特性:温度系数(TC)为±25ppm/℃——环境温度每变化1℃,阻值变化量不超过0.125Ω(5kΩ×25×10⁻⁶),稳定性显著优于普通电阻(通常TC≥±100ppm/℃),可适应宽温环境长期工作。
  4. 工作温度范围:-55℃~+155℃——覆盖工业级、汽车级极端温度场景(如寒带户外设备、发动机舱电路),无需额外散热或温度补偿。

三、封装与物理特性

AR02BTC5001采用0402封装(英制尺寸:0.04×0.02英寸,约1.0×0.5mm),是贴片电阻中体积较小的类型之一:

  • 体积紧凑,可大幅提升PCB元件密度,适配便携设备(智能手机、智能手表)、IoT传感器节点等小型化模块;
  • 封装工艺成熟,兼容回流焊、波峰焊等主流贴片工艺,生产效率高,焊接良率稳定。

四、品牌与可靠性保障

Viking(光颉)作为专业电阻制造商,在薄膜电阻领域拥有多年技术积累:

  • 采用真空溅射薄膜工艺,确保电阻膜层均匀性,阻值一致性与长期稳定性优异;
  • 产品经过严格可靠性测试(高低温循环、湿度老化、振动冲击),符合IEC、JIS国际标准,满足工业级、汽车级应用要求;
  • 批次一致性好,便于批量生产中的电路参数调试,降低测试与调试成本。

五、典型应用场景

结合参数特性,AR02BTC5001适用于以下场景:

  1. 精密仪器仪表:万用表、示波器、信号发生器的校准电路/信号放大支路,依赖高精密与低TC特性确保测量/输出准确性;
  2. 通信设备:小型基站、路由器、交换机的信号调理电路(滤波器、衰减器),小体积适配高密度PCB设计;
  3. 汽车电子:车载传感器(温度、压力、位置传感器)的信号处理电路,宽温范围覆盖汽车极端环境;
  4. 消费电子:智能手机、平板电脑的电源反馈回路、音频放大电路,满足小功率、小体积需求;
  5. 工业控制:PLC模拟量输入/输出模块,稳定阻值确保控制精度,适应工业现场温度波动。

六、总结

Viking光颉AR02BTC5001薄膜贴片电阻,以高精密(±0.1%)、低温度系数(±25ppm/℃)、宽温范围(-55℃~+155℃)、小体积(0402封装) 为核心优势,覆盖消费电子、工业、汽车等多领域应用,是追求性能稳定与设计紧凑的电子工程师可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.