Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AR02DTC1500是Viking(光颉)推出的0402封装高精度薄膜贴片电阻,针对小型化、高稳定性电路设计,核心聚焦「高精度+宽温稳+小体积」三大优势,适配消费电子、工业控制等多领域对阻值精度和环境适应性的双重需求。
该电阻的参数设计精准匹配0402封装的物理极限与应用场景需求,核心参数如下:
阻值固定为150Ω,精度控制在**±0.5%**——这一精度级别高于常规±1%精度的贴片电阻,可避免因阻值误差导致的信号失真或基准偏移,适合对精度敏感的信号调理、电压基准电路。
额定功率为62.5mW(0.0625W),最大工作电压25V,完全匹配0402封装的功率承载能力(常规0402贴片电阻功率多在1/16W即62.5mW左右),避免过载导致的电阻老化或失效。
温度系数为**±25ppm/℃**,即温度每变化1℃,阻值仅变化±25×10⁻⁶×150Ω≈±3.75mΩ——这一低TC值是薄膜电阻的典型优势,远优于碳膜电阻(通常±200ppm/℃以上),确保宽温区下阻值稳定。
覆盖**-55℃+155℃**,超出常规工业级(-40℃+125℃)的温区范围,可适配户外、高温工业设备(如冶金、石油勘探仪器)等极端温度场景。
采用英制0402封装(公制1005,尺寸约1.0mm×0.5mm),体积小巧,支持PCB高密度布线(如智能手机主板、小型化传感器模块),同时兼容自动化贴装产线,降低生产难度。
通过真空溅射薄膜技术制备电阻层,相比厚膜电阻(丝网印刷)具有三大优势:
符合贴片电阻通用可靠性标准(如湿度循环、振动冲击测试),宽温区设计经过高低温老化验证,确保长期工作无明显性能衰减。
该电阻因高精度、小体积、宽温稳的特性,广泛应用于以下场景:
AR02DTC1500以薄膜工艺为核心,平衡了「小体积」与「高精度/宽温稳」的矛盾,是小型化电路设计中替代常规碳膜/厚膜电阻的优选方案,尤其适合对阻值精度、环境适应性要求较高的工业级、消费电子类产品。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products