WMSIC Electronic Components

Viking ARG03FTC6800

ModelARG03FTC6800
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03FTC6800
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03FTC6800
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
680Ω
Electronic Component
1
Electronic Component
BM0265636735
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03FTC6800 薄膜贴片电阻产品概述

一、产品基本属性

ARG03FTC6800是Viking(光颉) 推出的一款0603封装薄膜贴片电阻,属于中高端小功率电阻系列。其核心定位为满足高精度、宽温区稳定性需求的电路设计,广泛适配工业控制、汽车电子、通信设备等对性能要求严格的领域。

二、关键性能参数详解

该电阻的参数围绕“稳定可靠、适配极端环境”设计,核心参数及实际意义如下:

  1. 阻值与精度:标称阻值680Ω,精度±1%——此精度等级可覆盖90%以上工业级电路对阻值一致性的要求,避免因偏差导致的信号失真或控制误差(如传感器信号放大电路中,1%精度可确保输出信号无明显漂移)。
  2. 功率等级:额定功率100mW——匹配0603小封装的典型功率上限,适合小信号调理、微弱电流放大等低功耗场景(如手机摄像头防抖电路、智能手表传感器模块)。
  3. 工作电压:最大工作电压75V——相比同封装常规电阻(多为50V),电压耐受能力提升50%,可适配中等电压范围的电路(如工业传感器供电、信号隔离电路)。
  4. 温度系数(TC):±25ppm/℃——温度系数是衡量阻值随温度变化的核心指标,±25ppm/℃表示温度每变化1℃,阻值变化仅百万分之25。即使在-55℃~+155℃的宽温区下,总阻值变化不足0.53%,大幅降低电路长期漂移风险。
  5. 工作温度范围:-55℃+155℃——符合汽车电子、户外工业设备等极端环境的温度要求(如发动机舱、户外PLC模块),可靠性远超消费级电阻(多为-40℃+85℃)。

三、封装与工艺优势

  1. 0603封装特性:英制0603对应公制1608(长1.6mm×宽0.8mm×厚0.45mm),体积小巧,可显著节省PCB布局空间,适配高密度电路设计(如智能手机主板、小型化工业控制器)。
  2. 薄膜电阻工艺:采用真空溅射金属薄膜技术制备电阻层,相比厚膜电阻,薄膜层更均匀、颗粒更细,具有三大优势:
    • 更低噪声:适合射频电路(如基站射频前端);
    • 更高长期稳定性:阻值漂移率低于0.1%/1000小时;
    • 更窄公差范围:可稳定实现±1%精度,无需额外筛选。

四、典型应用场景

ARG03FTC6800的参数特性使其可覆盖多领域核心场景:

  • 汽车电子:车载传感器(温度、压力)信号放大电路、仪表盘显示模块——宽温区满足发动机舱、低温环境下的稳定工作;
  • 工业控制:PLC输入输出模块、机器人伺服系统——高精度+低TC确保控制信号无偏差;
  • 通信设备:基站射频滤波电路、路由器信号调理——低噪声适配高频信号传输;
  • 消费电子:手机摄像头防抖电路、平板音频处理——小封装节省空间,高精度保证信号质量。

五、产品市场价值

作为光颉的中高端电阻产品,ARG03FTC6800在“精度-稳定性-成本”上实现平衡:

  • 对比同封装厚膜电阻:精度提升4倍(1% vs 5%)、TC降低75%(±25ppm/℃ vs ±100ppm/℃),适合性能要求严格的场景;
  • 对比同精度薄膜电阻:功率与电压参数适配性更强,宽温区覆盖更全面;
  • 品牌背书:Viking光颉通过AEC-Q200(汽车级)、RoHS等认证,产品可靠性符合国际标准,可直接用于车规级、工业级项目。

该电阻凭借“小体积、高精度、宽温稳定”的核心优势,成为中高端电路设计的优选元件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.