WMSIC Electronic Components

Viking ARG05FTC2053

ModelARG05FTC2053
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05FTC2053
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05FTC2053
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.029g
Electronic Component
205kΩ
Electronic Component
1
Electronic Component
BM0265636717
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG05FTC2053 薄膜贴片电阻产品概述

ARG05FTC2053是Viking(光颉)电子推出的一款0805封装薄膜贴片电阻,针对低功耗、高精度场景优化设计,具备宽温度适应性与稳定的电气性能,是工业控制、消费电子、IoT等领域的常用核心器件。

一、产品核心定位与基础参数

ARG05FTC2053定位于中高精度低功耗薄膜贴片电阻,核心参数清晰匹配多数小型化电路的需求,关键指标如下:

  • 阻值规格:205kΩ(三位数字标识“2053”,对应205×10³Ω);
  • 精度等级:±1%(薄膜电阻典型精度,优于碳膜电阻的±5%/±10%);
  • 功率容量:125mW(0805封装标准功率,满足低功耗电路需求);
  • 封装形式:0805(英制尺寸,公制2012,长2.0mm×宽1.2mm);
  • 品牌厂商:Viking(光颉)——国内专业电阻制造商,专注薄膜电阻研发超15年。

二、关键性能指标解析

ARG05FTC2053的性能围绕“高精度、宽温稳、小体积”核心设计,各指标的实际价值需结合应用场景理解:

1. 精度与长期稳定性

±1%的精度意味着阻值偏差控制在205kΩ±2.05kΩ范围内,可满足信号调理、分压电路等对阻值精确性要求较高的场景;同时,薄膜电阻采用真空溅射薄膜工艺(区别于碳膜印刷工艺),膜层均匀性好,长期使用后阻值漂移极小,1000小时老化测试后阻值变化率低于0.1%,适合需要长期稳定工作的设备。

2. 宽温度适应能力

  • 温度系数(TCR):±25ppm/℃——温度每变化1℃,阻值变化量为205kΩ×25×10⁻⁶=5.125Ω;若环境温度变化100℃(如-25℃→75℃),总漂移仅约512Ω,远低于普通电阻的漂移水平;
  • 工作温度范围:-55℃~+155℃——覆盖工业级、汽车级(辅助电路)的温度需求,可在高温车间、低温户外等极端环境下稳定工作。

3. 电气安全与功率特性

  • 最大工作电压:150V——额定功率下的安全电压上限,避免过压导致击穿;
  • 125mW功率容量:0805封装的合理设计,电路电流上限约787μA((I=\sqrt{P/R})),满足多数低功耗模块的电流需求。

三、封装与工艺优势

ARG05FTC2053采用0805表面贴装封装,具备以下工艺与物理优势:

  1. 体积小型化:2.0mm×1.2mm的紧凑尺寸,可提升电路集成密度,适配智能手机、智能手表等便携设备的高密度PCB;
  2. SMT兼容性:符合自动贴片机工艺标准,贴装效率高,降低生产制造成本;
  3. 抗环境干扰:薄膜电阻膜层封装于陶瓷基底,抗潮湿、抗振动能力强,可在湿度95%RH(40℃)环境下长期工作;
  4. 环保合规:符合RoHS 2.0、REACH标准,采用无铅端子,满足现代电子产业环保要求。

四、典型应用领域

ARG05FTC2053的性能匹配多类电子场景,核心应用包括:

  1. 工业控制:PLC模拟量输入/输出接口、传感器信号调理(如温度传感器分压网络);
  2. 消费电子:智能手机电源管理模块(电池电压分压)、平板音频滤波、智能电视信号阻抗匹配;
  3. IoT设备:智能穿戴(心率传感器电路)、智能家居(温湿度传感器信号调理);
  4. 通信设备:路由器信号滤波、射频前端阻抗匹配;
  5. 汽车电子(辅助):车载信息娱乐系统按键信号调理、低功耗传感器接口。

五、选型与替换参考

若需替换或拓展,可参考以下逻辑:

  • 同精度同封装:Viking ARG05FTC系列其他阻值(如100kΩ、330kΩ);
  • 同功率同阻值:其他品牌0805封装±1%薄膜电阻(如Yageo RC0805FR-07205KL);
  • 精度升级:需±0.1%精度可选择Viking ARG05FTC2053F(高精度子系列)。

综上,ARG05FTC2053凭借高精度、宽温稳、小体积、高可靠性的综合优势,成为低功耗高精度电路设计的优选器件,可覆盖多数工业与消费电子场景的需求。

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