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Viking AR02BTD5101
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Viking AR02BTD5101
- Type
- VIKING
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- VIKING
- Electronic Component
- AR02BTD5101
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.009g
- Electronic Component
- 5.1kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264911529
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±50ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AR02BTD5101 薄膜贴片电阻产品概述
AR02BTD5101是台湾光颉（Viking）针对小型化精密电路开发的0402封装薄膜贴片电阻，凭借±0.1%高阻值精度、±50ppm/℃低温度系数及宽温适应性，成为消费电子、工业控制、医疗仪器等领域的核心被动元件之一。
一、产品定位与核心价值
该电阻聚焦**“小体积+高精度+高稳定性”** 三大核心需求，解决传统厚膜电阻精度不足、温度漂移大的痛点，适配高密度贴装场景（如智能手机主板、微型传感器模块）。其核心价值体现在：
- 替代普通±1%精度电阻，提升电路测量/控制精度；
- 低温度系数减少温变下的阻值漂移，降低电路校准成本；
- 0402封装满足设备“轻薄化”设计趋势，节省PCB空间。
二、关键性能参数深度解析
参数项 具体规格 实际意义说明 电阻类型 薄膜电阻 比厚膜电阻精度更高、温漂更小 标称阻值 5.1kΩ（5101） 符合E96系列高精度阻值规范 阻值精度 ±0.1% 阻值偏差极小，适合精密分压/限流 额定功率 62.5mW（1/16W） 匹配0402封装的功率极限，满足小功率电路 最大工作电压 25V 电压上限符合安全规范，避免击穿 温度系数（TCR） ±50ppm/℃ 每变化1℃，阻值变化±50×10^-6Ω，稳定性优异 工作温度范围 -55℃~+155℃ 覆盖工业级宽温场景，适应极端环境三、封装与制造工艺特点
1. 0402封装尺寸
封装规格为1.0mm×0.5mm×0.43mm（长×宽×高），是当前小型化设备的主流封装之一，可实现每平方厘米超过1000个电阻的贴装密度，显著降低PCB面积。
2. 薄膜电阻制造工艺
光颉采用磁控溅射镍铬薄膜技术：
- 以高纯度氧化铝陶瓷为基底，确保热稳定性；
- 精准控制薄膜厚度（纳米级），实现阻值一致性；
- 激光微调阻值，将精度控制在±0.1%以内；
- 表面涂覆环氧树脂保护层，提升耐湿性与机械强度。
四、典型应用场景
1. 便携式消费电子
- 智能手机/手表：传感器信号调理电路（如加速度计、心率传感器）；
- 无线耳机：蓝牙模块的偏置电路、滤波网络。
2. 工业控制模块
- PLC模拟量输入输出：精密分压电路（将4-20mA信号转换为0-5V）；
- 电机驱动：电流采样电阻（低漂移确保采样精度）。
3. 医疗电子设备
- 血糖仪：血糖浓度测量的精密放大电路；
- 监护仪：心电信号滤波与放大。
4. 通信设备
- 小型基站：射频前端的匹配网络；
- 路由器：电源管理模块的限流电阻。
五、可靠性与环境适应性
1. 宽温稳定性
在-55℃~+155℃范围内，阻值变化≤±0.05%（基于TCR计算），可长期稳定工作于高温/低温环境（如户外工业设备）。
2. 耐焊接与机械性能
- 回流焊兼容性：可承受260℃/10s的焊接温度，无封装开裂、阻值漂移；
- 抗弯折能力：0402封装可承受1mm弯折半径，适应PCB弯曲场景；
- 耐湿性：85℃/85%RH环境下放置1000h，阻值变化≤±0.1%。
3. 长期可靠性
通过光颉内部加速老化测试（125℃/1000h），阻值变化≤±0.02%，满足工业级产品5年以上使用寿命要求。
总结
AR02BTD5101薄膜贴片电阻以高精度、小体积、高稳定性为核心竞争力，覆盖多领域精密电路需求。其薄膜工艺与0402封装的结合，既满足设备轻薄化趋势，又解决了传统电阻的精度痛点，是光颉在被动元件领域的代表性产品之一。
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