Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Viking AR02BTC0510
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Viking AR02BTC0510
- Type
- VIKING
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- VIKING
- Electronic Component
- AR02BTC0510
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.009g
- Electronic Component
- 51Ω
- Electronic Component
- 1
- Electronic Component
- BM0264911563
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AR02BTC0510 薄膜贴片电阻产品概述
一、产品基本标识
AR02BTC0510是Viking（光颉） 品牌推出的高精密薄膜贴片电阻，采用行业标准0402封装（英制尺寸：0.04英寸×0.02英寸，公制约1.0mm×0.5mm），属于小型化高密度贴装元件范畴。该型号以“高精准度、低温度漂移、宽温适应性”为核心特点，适配对电性能稳定性要求严苛的电子场景。
二、核心电性能参数解析
该电阻的关键参数直接决定应用边界，具体如下：
- 阻值与精度：标称阻值51Ω，精度等级达**±0.1%**——常温下实际阻值偏差不超过0.051Ω，可满足精密电路中分压、限流、信号调理等对阻值一致性的高要求；
- 功率与电压额定值：额定功率62.5mW，最大工作电压25V。实际使用需同时满足两个限制（例如25V电压下，功率计算为(25V)²/51Ω≈12.25mW，远低于额定功率，此时电压为主要约束）；
- 温度系数（TCR）：典型值±25ppm/℃——温度每变化1℃，阻值变化仅约1.275μΩ，极低温漂确保宽温下阻值稳定，减少环境温度对电路的影响。
三、环境适应性表现
AR02BTC0510的工作温度范围覆盖**-55℃至+155℃**，远超普通贴片电阻的常规上限（通常≤125℃），适配极端环境：
- 低温场景：北方户外通信基站、极地科考设备等，避免低温导致的阻值漂移；
- 高温场景：汽车发动机舱电路、工业变频器高温区域等，支撑高负荷稳定运行；
此外，薄膜电阻的真空沉积结构（优于厚膜电阻的热稳定性），进一步强化了宽温可靠性。
四、封装与应用场景匹配
0402封装的小型化特点，使该电阻成为高密度贴装电路的理想选择，典型应用包括：
- 消费电子便携设备：智能手机、智能手表、蓝牙耳机等，有限空间内集成大量元件；
- 工业自动化控制：PLC模块、传感器信号调理电路，高精密与宽温确保控制精度；
- 通信设备：5G小基站、光纤收发器，稳定电阻保障信号传输一致性；
- 医疗电子仪器：血糖监测仪、心电监护仪的信号放大电路，±0.1%精度避免测量误差；
- 汽车电子：车身控制模块（BCM）、传感器电路，宽温适配发动机舱高温环境。
五、产品优势总结
相较于同封装厚膜电阻，AR02BTC0510的核心优势在于：
- 高精准度：±0.1%精度满足精密电路一致性；
- 低温度漂移：±25ppm/℃确保宽温阻值稳定；
- 宽温适应性：-55℃~+155℃覆盖极端场景；
- 小型化集成：0402封装适配高密度贴装；
- 品牌可靠性：Viking（光颉）的制造工艺保障产品一致性。
该电阻凭借上述特点，成为多领域精密电路设计的可靠选择，尤其适合对“精度、稳定性、体积”有综合要求的应用场景。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
