WMSIC Electronic Components

Viking ARG02FTC6980

ModelARG02FTC6980
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG02FTC6980
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG02FTC6980
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
698Ω
Electronic Component
1
Electronic Component
BM0265378858
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉ARG02FTC6980薄膜贴片电阻产品概述

Viking光颉ARG02FTC6980是一款专为高密度、高精密电路设计的0402封装薄膜贴片电阻,兼具小体积、高稳定性与宽温适应性,可满足消费电子、工业控制、汽车电子等多领域的低功耗信号处理需求。

一、产品核心定位与典型应用场景

ARG02FTC6980属于高精密小功率薄膜贴片电阻,聚焦于对阻值精度、温度稳定性要求较高的微型电路设计:

  • 消费电子领域:适配智能手机、智能穿戴设备的信号调理电路(如传感器接口、音频放大偏置),利用0402小封装提升PCB集成度;
  • 工业控制领域:用于PLC模块的微小信号放大、传感器校准电路,±1%精度与±25ppm/℃温度系数确保温度波动下的信号准确性;
  • 汽车电子领域:符合-55℃~+155℃宽温范围,可应用于车载低功耗传感器(如胎压监测、环境传感器)的信号链路;
  • 医疗设备领域:适配便携式医疗仪器(如血糖监测仪、小型监护仪)的信号路径,薄膜工艺的低噪声特性减少信号干扰。

二、关键性能参数深度解析

ARG02FTC6980的核心参数围绕“高精密、宽温稳、小体积”设计,具体如下:

  1. 阻值与精度:标称阻值698Ω,精度±1%(行业常规高精密等级),可满足射频电路阻抗匹配、ADC参考电阻等对阻值准确性要求的场景;
  2. 功率与电压额定值:额定功率62.5mW(0.0625W),额定工作电压50V,适合低功耗电路(如电池供电设备),避免过功率/过电压损坏;
  3. 温度系数(TCR):±25ppm/℃,表示温度每变化1℃,阻值变化约±0.017Ω(计算:25×10^-6×698≈0.01745),远优于普通厚膜电阻(通常±100ppm/℃以上),确保宽温环境下的阻值稳定性;
  4. 工作温度范围:-55℃+155℃,覆盖工业级(-40125℃)与部分汽车级(-55~150℃)的温度需求,可适应户外、车载等极端环境。

三、封装与工艺的技术优势

ARG02FTC6980采用0402英制封装(公制1005,尺寸0.04×0.02英寸),搭配薄膜工艺实现性能与体积的平衡:

  • 小体积高密度:0402封装是当前贴片电阻的主流微型封装之一,可在单位PCB面积上集成更多元件,提升电路集成度;
  • 薄膜工艺特性:采用Ni-Cr(镍铬)薄膜电阻层,相比厚膜电阻(丝网印刷工艺),具有:
    • 更高的阻值精度与温度稳定性;
    • 更低的噪声系数,适合微弱信号处理;
    • 更好的长期可靠性(耐老化、抗潮湿)。

四、可靠性与环境适应性验证

ARG02FTC6980通过多项可靠性测试,满足工业级与汽车级的基础要求:

  1. 宽温稳定性:在-55℃~+155℃范围内,阻值变化率控制在0.3%以内(基于TCR计算),可长期稳定工作;
  2. 耐环境性能:符合RoHS 2.0与无卤标准,抗潮湿(湿度95%RH以下)、抗振动(10~2000Hz)性能优异,适合 harsh环境;
  3. 长期可靠性:经1000小时高温老化测试(125℃),阻值变化率≤0.2%,确保产品生命周期内的性能一致性。

五、选型与使用注意事项

为确保ARG02FTC6980的性能与寿命,需注意以下要点:

  1. 功率降额:实际使用功率建议不超过额定功率的50%(即31.25mW),避免热应力导致阻值漂移;
  2. 电压限制:工作电压不得超过50V,防止薄膜层击穿;
  3. 焊接工艺:采用回流焊时,需遵循0402封装的标准温度曲线(峰值温度≤245℃,回流时间≤30秒),避免热损伤;
  4. 应用匹配:仅适用于低功耗、高精密电路,不建议用于大功率电源电路(如功率电阻)或高压场景(如超过50V的电路)。

总结:Viking光颉ARG02FTC6980以“高精密、小体积、宽温稳”为核心优势,是消费电子、工业控制等领域微型高精密电路的理想选择,可有效提升电路集成度与信号处理准确性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.