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Viking光颉AR02BTD4702是一款针对高精度、小体积、宽温稳定需求设计的0402封装薄膜贴片电阻,依托光颉成熟的薄膜电阻工艺,在工业控制、精密仪器、消费电子等领域具备广泛适配性,是高密度电路设计的优选元件。
AR02BTD4702隶属于光颉AR02BT系列薄膜电阻,型号编码对应核心参数:
产品采用贴片式封装,无需穿孔安装,适配SMT自动化生产,可直接焊接于PCB表面,显著节省电路板空间。
该电阻的参数针对专业场景优化,关键指标如下:
阻值固定为47kΩ,精度达**±0.1%**(行业高精度级别),能有效避免因阻值偏差导致的信号失真(如校准电路、放大电路的误差累积)。
温度系数为**±50ppm/℃**,表示环境温度每变化1℃,阻值变化幅度不超过±50ppm(即0.005%)。此参数远优于碳膜电阻(通常±200ppm/℃以上),薄膜电阻的真空镀膜工艺使其阻值随温度波动极小,适合温度变化剧烈的场景。
覆盖**-55℃~+155℃**,符合工业级宽温要求,可在极端环境(如低温高原、高温车间)下稳定工作,无需额外温度补偿电路。
AR02BTD4702采用0402封装,标准尺寸为0.04英寸×0.02英寸(约1.0mm×0.5mm),是贴片电阻中体积最小的规格之一,适配高密度PCB设计(如智能手机主板、小型医疗设备)。
封装采用两端电极设计,焊盘与PCB兼容性强,支持回流焊、波峰焊等工艺,焊接后抗振动性能优异(符合IEC 60068-2-6振动测试标准),可承受运输、使用中的机械应力。
光颉作为全球薄膜电阻核心供应商,AR02BTD4702具备以下可靠性保障:
该电阻的性能特点使其适用于多场景:
综上,Viking光颉AR02BTD4702薄膜贴片电阻凭借高精度、宽温稳定、小体积等核心优势,可有效提升电子设备的性能与可靠性,是高密度电路设计的高性价比选择。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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