WMSIC Electronic Components

Viking ARG05BTC3571

ModelARG05BTC3571
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05BTC3571
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05BTC3571
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.028g
Electronic Component
3.57kΩ
Electronic Component
1
Electronic Component
BM0265636723
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG05BTC3571 薄膜贴片电阻产品概述

一、产品基础定位与身份

ARG05BTC3571是Viking(光颉) 推出的0805封装精密薄膜贴片电阻,属于工业级小功率电阻范畴。型号命名中:

  • ARG 为光颉精密电阻系列标识;
  • 05 对应0805英制封装(公制2012);
  • BTC 代表薄膜电阻工艺;
  • 3571 表示额定阻值为 3.57kΩ(357×10¹Ω)。

该产品聚焦“高精度+宽温稳定”核心需求,适配对阻值一致性、环境适应性要求较高的电子电路设计。

二、核心性能参数及技术优势

ARG05BTC3571的参数精准定义了其应用边界与性能表现:

  1. 阻值与精度:额定阻值3.57kΩ,精度±0.1%——远高于普通碳膜/金属膜电阻(±1%~±5%),可满足精密信号调理、阻抗匹配等场景对阻值一致性的要求;
  2. 功率与电压:额定功率125mW,最大工作电压150V,适配低功耗、中低压系统(如传感器模块、通信射频前端);
  3. 温度稳定性:温度系数(TCR)±25ppm/℃——在-55℃~+155℃范围内,阻值漂移极小(温度变化100℃时,阻值变化仅±0.89Ω),保障宽温环境下电路性能稳定;
  4. 工艺优势:采用薄膜电阻工艺,相比厚膜电阻具有更低噪声(典型值<0.1μV/√Hz)、**更高高频特性**(截止频率>1GHz),适合射频与高速信号电路。

三、封装设计与可靠性保障

  1. 封装规格:0805英制贴片封装(尺寸2.0mm×1.2mm×0.5mm),兼容常规SMT贴装设备,支持回流焊、波峰焊工艺,焊接可靠性符合IPC-J-STD-001标准;
  2. 抗环境能力:封装采用耐高温环氧树脂包封,具备抗潮湿(湿度90%RH无凝露环境下稳定工作)、抗机械应力(可承受±20G振动)、抗化学腐蚀能力,适应工业现场、户外设备等复杂场景;
  3. 长期稳定性:经光颉内部可靠性测试(1000小时负载寿命测试、温度循环测试),阻值变化率<0.05%,确保生命周期内性能稳定。

四、典型应用场景

ARG05BTC3571的性能特性使其广泛适配以下领域:

  1. 精密测量仪器:示波器、信号发生器、万用表的信号放大/滤波电路,依赖高精度阻值实现信号精准采集;
  2. 工业控制模块:PLC输入输出电路、传感器信号调理单元(如压力/温度传感器放大电路),宽温特性适配工业现场-20℃~+60℃环境;
  3. 通信设备:5G基站射频前端的阻抗匹配网络、滤波器,薄膜工艺的低噪声与高频特性提升信号传输质量;
  4. 医疗电子:监护仪、输液泵的信号处理电路,高精度与稳定性保障医疗数据准确性;
  5. 汽车电子:车载信息娱乐系统低功耗模块(如仪表盘背光控制),工作温度覆盖汽车级-40℃~+125℃需求。

五、环境适应性与寿命预期

  1. 工作温度范围:-55℃~+155℃,超出常规汽车电子范围,可满足航空航天、军工等极端环境需求;
  2. 存储条件:建议存储温度-55℃~+125℃,湿度<90%RH(无凝露),存储周期不超过12个月;
  3. 寿命预期:额定工作条件下,平均无故障工作时间(MTBF)>10⁶小时,符合IEC 61040《固定电阻器总规范》可靠性要求。

ARG05BTC3571凭借“高精度、宽温稳定、小体积”的综合优势,成为精密电子领域的高性价比选择,可有效降低电路设计的参数偏差风险。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.